Nokia E62 - Multimedia Messages

Item Side Grid reference Description and value
C7596 Top K 23 0402C
Chipcap 5%
NP0 100p 50V
C7597 Bottom M 3 0402C
Chipcap 5%
NP0 100p 50V
D2200 Bottom C 8 TFBGA_108
RETU 3.02
TSA1GJWE
TFBGA108 ~ ~
D2800 Bottom K 10 uBGA_289
RAPGSM V1.1
PA uBGA289 ~ ~
D3000 Bottom L 7
FBGA133_11
.6X13.1
COMBO
256MNOR
+1GM3
+256MDDRSDR
AM FBGA133
8Mx16/16M
x16/8Mx16 ~
D4400 Bottom C 13 LLP_44
MCU E 8BIT
COP8TAB5HYQ
8 LLP44 ~ ~
F2000 Bottom C 4
0603_FUSE_
AVX2MATS
SM FUSE F 2.0A
32V 2A ~
G2200 Bottom B 12
BATTER_EEC
EP
RTC BACUP
CAPAC 311 SIZE
FOR 2.6V 4UAH 2.6V ~
G7500 Bottom H 12
VCO_DCS027
33
VCO
3296-3980MH
Z 4-BAND
MATSUSHITA
3296-3980
MHz ~
G7501 Bottom F 11
NKG3176B_
H1.0
VCTCXO
38.4MHZ 2.5V 38.4MHz ~
L2000 Bottom D 4 0603_BLM
FERR.BEAD
220R/100M 2A
0R05 0603
220R/
100MHz ~
L2100 Top F 23
0405_2_MAT
SU
CHIP BEAD
ARRAY
2X1000R 0405
2x1000R/
100MHz ~
L2102 Bottom B 20
COIL_0603C
S
CHIP COIL 56N J
Q38/250MHZ
0603 56nH ~
L2103 Bottom B 20
COIL_0603C
S
CHIP COIL 56N J
Q38/250MHZ
0603 56nH ~
L2202 Bottom E 9 0603_BLM
FERR.BEAD
220R/100M 2A
0R05 0603
220R/
100MHz ~
RM-88
Parts Lists and Component Layouts Nokia Customer Care
Issue 1 COMPANY CONFIDENTIAL Page 2 –17
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