DIS-23
SECTION 2 DISASSEMBLY PROCEDURES
<RZ31K/RS30K>
Heat dissipation compound :
Shin-Etsu Silicone [ G-776 ] grade 1g
A
B
B
C
2. 19. Lighting block 1 removal
1. Remove the Lighting block 2 following to step [2.15. Lighting block 2 removal].
2. Unscrew 5 screws-A and remove the LC joint unit upward.
3. Unscrew 5 screws-B, 2 screws-C and remove the lighting block 1 upward.
Lighting block 1
LC joint unit
2. 20. Liquid cooling unit 1 removal
1. Remove the lighting block 1 referring to step [2.16. Lighting block 2 removal].
Torque: 70±10 N•cm
B
A
C
D
Liquid cooling pump 1S
Liquid cooling pump 1B
Heat receiving plate 1S
Heat receiving plate 1B
Liquid cooling tank 1S
Radiator 1S
Radiator 1B
Lighting block 1
Liquid cooling tank 1B
A
C
B
Torque: 70±10 N•cm
A
C
B
D
[Note on mounting]
• Apply the heat dissipation compound evenly to
the rear surface of liquid cooling pump and heat
receiving plate.
• Take care not to stick out the compound
Apply heat dissipation
compound