142 Rockwell Automation Publication 750-RM004A-EN-P - April 2018
Appendix A Enclosure Information
Mounting Requirements
• Install the product upright on a flat and level surface.
• Verify that the product cabinet is square, vertical, and stable.
• Verify that the filter and debris screens are installed.
• Protect the cooling fan by avoiding dust or metallic particles.
• Do not expose to a corrosive atmosphere.
• Protect from moisture and direct sunlight.
• The product must be anchored on a level floor. See outline dimension
drawings for the anchor point sizes and locations.
Table 70 - Environmental Specifications
Ambient temperature IP21, UL Type 1: -20…+40 °C (-4…+104 °F) frames 8…12, all ratings
IP54, UL Type 12: -20…+40 °C (-4…+104 °F) frames 8…12, all ratings
Ambient temperature of 50 °C (122 °F) or 55 °C (134 °F) with derating.
Storage temperature -40…+70 °C (-40…+158 °F)
Relative humidity 5…95% noncondensing
Atmospheric protection Harsh environment is defined as a copper or silver reactivity level greater than
1000 angstroms per 30 days exposure. No condensation allowed. Maximum allowable
humidity is 60% in the presence of corrosive gases. See ISA-71.04-2013 for details on
how to measure reactivity levels on copper and silver test coupons.
Table 71 - Airflow Requirements
Frame
755TL and 755TR Drives 755TM Bus Supplies 755TM Common Bus Inverter
CFM (ft
3
/min) CMS (m
3
/sec) CFM (ft
3
/min) CMS (m
3
/sec) CFM (ft
3
/min) CMS (m
3
/sec)
8 2375 1.12 1675 0.79 975 0.46
9 3775 1.78 2375 1.12 1675 0.79
10 6500 3.07 4400 2.08 2375 1.12
11 7900 3.73 5100 2.41 3075 1.45
12 10,000 4.72 6500 3.07 3775 1.78
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