OPERATION OF THE MJB4
MJB4 - Operation Rev02 01-06 15
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3. OPERATION OF THE MJB4
The MJB4 Mask Aligner allows contact exposures of
different types (vacuum, hard, soft contact) as well
as exposures at short distances and can be used to
transfer structure measurements down to the
submicron range.
The achievable adjustment accuracy X, Y and theta
is below 1 µm.
Masks and wafer/substrates to a total thickness of
9.00 mm can be processed.
The MJB4 is equipped with 400 nm exposure optics
and lamps that allow a resolution of< 1µm in vacuum
contact. Using 300 or 250 nm exposure optics or an
Excimer laser results in a significantly lower
resolution.
Modular construction ensures that the components
are easy to service. Function groups are easy to
reach and the individual modules, such as for the
pneumatic system and the PLC controller, can be
quickly replaced.
SUSS MJB4 Mask Aligner
1 TSA/IR lighting
2 Microscope focus setting
3 TSA microscope
4 TSA microscope manipulator
5 Lamp housing
6 Main switch with emergency off function
7 Adjusting table
8 Display/touch screen
9 Electronics ON/OFF key
10 Pneumatic settings
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