CONTENTS
II MJB4 - Contents Rev02 01-06
i
3.2.8. Basic Pneumatic Settings ....................................................................21
3.3. Operating Sequences ...................................................................................22
3.3.1. Switching the Machine On/Off .............................................................22
3.3.2. Switching On and Calibrating the Exposure Lamp ..............................23
3.3.3. Setting Exposure Values .....................................................................24
3.3.4. Saving and Loading Programs ............................................................25
3.3.5. Loading the Mask ................................................................................26
3.3.6. Loading the Substrate .........................................................................26
3.3.7. Setting the Mask Substrate Thickness ................................................26
3.3.8. Wedge Error Compensation Pressure ................................................27
3.3.9. Wedge Error Compensation (WEC) ....................................................27
3.4. First Exposure of Substrate ...........................................................................28
3.4.1. Set the Exposure Values .....................................................................28
3.4.2. Loading the Mask ................................................................................28
3.4.3. Loading the Substrate .........................................................................28
3.5. Adjusting the Substrate with the Upper Microscope .....................................29
3.5.1. Setting the Exposure Values ...............................................................29
3.5.2. Loading the Mask ................................................................................29
3.5.3. Loading the Substrate .........................................................................29
3.5.4. Adjusting the Microscope ....................................................................29
3.5.5. Adjusting the Substrate .......................................................................29
3.5.6. Exposure .............................................................................................30
3.5.7. Unloading the Mask .............................................................................30
3.6. Adjusting the Substrate with IR Lighting .......................................................30
3.6.1. Incident Light .......................................................................................30
3.6.2. Transmitted Light .................................................................................32
3.7. Advanced Techniques ...................................................................................33
3.7.1. Exposure Programs .............................................................................33
3.7.2. Multiple Exposure ................................................................................34
3.8. Step-by-step Machine Operation ..................................................................35
3.8.1. Selecting exposure program, e.g., soft contact ...................................35
3.8.2. Programs .............................................................................................36
3.8.3. Loading, Adjusting and Exposing the Substrate ..................................37
4. Appendix .............................................................................................................39
4.1. Parameter Ranges and Default Settings .......................................................39
4.2. List of Abbreviations .....................................................................................40
4.3. Index ............................................................................................................. 42
4.4. Spare Parts List (extract) ..............................................................................43
4.5. Service Information .......................................................................................48
4.5.1. Overview .............................................................................................49
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