Table of Contents
1 Features............................................................................1
2 Applications.....................................................................2
3 Description.......................................................................2
4 Functional Block Diagram.............................................. 3
5 Device Comparison.........................................................5
6 Pin Configuration and Functions...................................6
6.1 Pin Diagrams.............................................................. 6
6.2 Pin Attributes.............................................................12
6.3 Signal Descriptions................................................... 15
6.4 Connections for Unused Pins................................... 27
7 Specifications................................................................ 28
7.1 Absolute Maximum Ratings...................................... 28
7.2 ESD Ratings............................................................. 28
7.3 Recommended Operating Conditions.......................28
7.4 Thermal Information..................................................29
7.5 Supply Current Characteristics................................. 30
7.6 Power Supply Sequencing........................................31
7.7 Flash Memory Characteristics.................................. 32
7.8 Timing Characteristics...............................................33
7.9 Clock Specifications..................................................34
7.10 Digital IO................................................................. 37
7.11 Analog Mux VBOOST............................................. 39
7.12 ADC........................................................................ 39
7.13 Temperature Sensor............................................... 41
7.14 VREF...................................................................... 41
7.15 Comparator (COMP)...............................................42
7.16 DAC........................................................................ 42
7.17 GPAMP................................................................... 44
7.18 OPA.........................................................................45
7.19 I2C.......................................................................... 47
7.20 SPI.......................................................................... 48
7.21 UART...................................................................... 50
7.22 TIMx........................................................................50
7.23 TRNG......................................................................50
7.24 Emulation and Debug............................................. 51
8 Detailed Description......................................................52
8.1 CPU.......................................................................... 52
8.2 Operating Modes...................................................... 52
8.3 Power Management Unit (PMU)...............................54
8.4 Clock Module (CKM).................................................54
8.5 DMA..........................................................................55
8.6 Events.......................................................................56
8.7 Memory.....................................................................57
8.8 Flash Memory........................................................... 60
8.9 SRAM........................................................................61
8.10 GPIO.......................................................................61
8.11 IOMUX.................................................................... 61
8.12 ADC........................................................................ 61
8.13 Temperature Sensor............................................... 62
8.14 VREF...................................................................... 62
8.15 COMP..................................................................... 62
8.16 DAC........................................................................ 64
8.17 OPA.........................................................................64
8.18 GPAMP................................................................... 65
8.19 TRNG......................................................................65
8.20 AES.........................................................................65
8.21 CRC........................................................................ 65
8.22 MATHACL...............................................................66
8.23 UART...................................................................... 66
8.24 I2C.......................................................................... 67
8.25 SPI.......................................................................... 67
8.26 CAN-FD.................................................................. 67
8.27 WWDT.................................................................... 68
8.28 RTC.........................................................................68
8.29 Timers (TIMx)..........................................................68
8.30 Device Analog Connections....................................70
8.31 Input/Output Diagrams............................................71
8.32 Serial Wire Debug Interface....................................72
8.33 Boot Strap Loader (BSL).........................................72
8.34 Device Factory Constants ......................................72
8.35 Identification............................................................73
9 Applications, Implementation, and Layout................. 74
9.1 Typical Application.................................................... 74
10 Device and Documentation Support..........................75
10.1 Getting Started and Next Steps.............................. 75
10.2 Device Nomenclature..............................................75
10.3 Tools and Software................................................. 76
10.4 Documentation Support.......................................... 77
10.5 Support Resources................................................. 77
10.6 Trademarks.............................................................77
10.7 Electrostatic Discharge Caution..............................77
10.8 Glossary..................................................................77
11 Mechanical, Packaging, and Orderable
Information.................................................................... 78
12 Revision History.......................................................... 78
MSPM0G3507, MSPM0G3506, MSPM0G3505
SLASEX6A – FEBRUARY 2023 – REVISED JUNE 2023
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