10 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed below.
10.1 Getting Started and Next Steps
For more information on the MSP low-power microcontrollers and the tools and libraries that are available to help
with development, visit the Texas Instruments Arm Cortex-M0+ MCUs page.
10.2 Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all MSP
MCU devices and support tools. . Each MSP MCU commercial family member has one of two prefixes: MSP
or X. These prefixes represent evolutionary stages of product development from engineering prototypes (X)
through fully qualified production devices (MSP).
X – Experimental device that is not necessarily representative of the final device's electrical specifications
MSP – Fully qualified production device
X devices are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes." MSP devices have been characterized
fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (X) have a greater failure rate than the standard production devices. TI
recommends that these devices not be used in any production system because their expected end-use failure
rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the temperature
range, package type, and distribution format. Figure 10-1 provides a legend for reading the complete device
name.
MSP M0 G 350 7 S RHB R
Processor Family
MCU Pla
orm
Product Family
Device Subfamily Flash Memory
Temperature range
Package Type
Distribuon Format
Figure 10-1. Device Nomenclature
Table 10-1. Device Nomenclature
Processor Family
MSP = Mixed-signal processor
X= Experimental silicon
MCU Platform M0 = Arm based 32-bit M0+
Product Family G = 80-MHz frequency
Device Subfamily 350 = CAN-FD, 2x ADC, 2x OPA, 3x COMP
Flash Memory
5 = 32KB
6 = 64KB
7 = 128KB
Temperature Range S = –40°C to 125°C
Package Type See the Device Comparison section and https://www.ti.com/packaging
Distribution Format
T = Small reel
R = Large reel
No marking = Tube or tray
www.ti.com
MSPM0G3507, MSPM0G3506, MSPM0G3505
SLASEX6A – FEBRUARY 2023 – REVISED JUNE 2023
Copyright © 2023 Texas Instruments Incorporated
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Product Folder Links: MSPM0G3507 MSPM0G3506 MSPM0G3505
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