© 2008 - 2011 TOSHIBA TEC CORPORATION All rights reserved e-STUDIO2020C/2330C/2820C/2830C/3520C/3530C/4520C
CONTENTS
5
7.1.13 SRAM board <for SYS board>...............................................................................7-13
7.2 Precautions, Procedures and Settings for Replacing PC Boards and HDD......................7-15
7.2.1 Precautions when replacing PC boards .................................................................7-15
7.2.2 HDD fault diagnosis................................................................................................7-16
7.2.3 Precautions and procedures when replacing the HDD...........................................7-18
7.2.4 Precautions and Procedures when replacing the SYS board ................................ 7-23
7.2.5 Procedures and settings when replacing the SLG board ......................................7-24
7.2.6 Precautions and procedure when replacing the SRAM board (for the SYS board)7-25
7.2.7 Procedures and settings when replacing SRAM board (for LGC board)................7-29
7.2.8 Firmware confirmation after the PC board/HDD replacement................................7-31
7.2.9 Electronic key re-registration using the one-time dongle........................................7-32
7.3 Precautions for Installation of GP-1070 and Disposal of HDD/Board................................7-33
7.3.1 Precautions for Installation of GP-1070 and Disposal of HDD/Board.....................7-33
7.3.2 Precautions when disposing of the SYS board ......................................................7-33
7.3.3 Precautions when disposing of the SRAM board ...................................................7-33
8. FIRMWARE UPDATING ...............................................................................................8-1
8.1 Firmware Updating with USB Media....................................................................................8-5
8.1.1 Master data/System ROM/Engine ROM/Scanner ROM...........................................8-7
8.1.2 Imaging Acceleration Board ROM (GE-1170) ........................................................8-17
8.2 Firmware Updating with PWA-DWNLD-350-JIG2 .............................................................8-23
8.2.1 Writing the data to the download jig (PWA-DWNLD-350-JIG2) .............................8-24
8.2.2 System ROM ..........................................................................................................8-27
8.2.3 Engine ROM...........................................................................................................8-29
8.3 Firmware Updating with K-PWA-DLM-320........................................................................8-32
8.3.1 Scanner ROM......................................................................................................... 8-33
8.3.2 RADF firmware (MR-3018).....................................................................................8-35
8.3.3 Finisher firmware (MJ-1101)................................................................................... 8-37
8.3.4 Converter Firmware (MJ-1101) ..............................................................................8-39
8.3.5 Hole punch unit firmware (MJ-6101) ......................................................................8-43
8.3.6 Finisher firmware/Saddle stitcher firmware (MJ-1030)...........................................8-47
8.3.7 Finisher firmware (MJ-1031)................................................................................... 8-51
8.3.8 Fax unit firmware (GD-1250)..................................................................................8-54
8.4 Confirmation of the updated data ......................................................................................8-56
8.5 When Firmware Updating Fails .........................................................................................8-57
8.5.1 Procedure............................................................................................................... 8-57
8.5.2 Flow chart for correcting USB update failure.......................................................... 8-58
9. POWER SUPPLY UNIT ................................................................................................9-1
9.1 General description..............................................................................................................9-1
9.2 Construction.........................................................................................................................9-1
9.3 Operation of DC Output Circuits..........................................................................................9-2
9.4 Output Channel ...................................................................................................................9-3
9.5 Fuse.....................................................................................................................................9-5
9.6 Configuration of Power Supply Unit.....................................................................................9-6
9.7 Sequence of Power Supply .................................................................................................9-7
9.8 AC Wire Harness.................................................................................................................9-9
10. DC WIRE HARNESS / ELECTRIC PARTS LAYOUT.................................................10-1
10.1 DC Wire Harness...............................................................................................................10-1
10.2 Electric Parts Layout..........................................................................................................10-2
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