Chapter 1: Memory Array Hardware Installation
14
Violin 6000 Series Memory Array Installation Guide
535-0045-00 Rev 02
For a dual PCIe x8 connection to two host computers, connect one PCIe cable to the top PCIe
connector on one of the ACMs, and connect the other PCIe cable to the bottom of the same ACM.
Connect the other end of the PCIe cable to the host machine. Connect the second host machine to
the other ACM in the same manner.
Where hosts share the same volume, a mechanism is needed to ensure the two hosts share the
volume productively and do not overwrite each other’s data. This can be done via a clustered file
system (e.g., GPFS, GFS, Veritas) or by partitioning the volume and explicitly assigning partitions
to each host over PCIe.
Installing the Memory Array
Follow the steps in this section to install the Memory Array in an equipment rack and to connect the
system directly to a host machine or to a network.
Managing Thermal Heat Impact Within the
Equipment Rack
Follow these recommendations to minimize the heat impact within an equipment rack when
deploying Memory Arrays in a high-density configuration:
• Equipment racks should be populated with the heaviest and most power-dense equipment at
the bottom. Install the Memory Arrays from the bottom up, for the following reasons:
— Weight: To maintain the lowest center of gravity.
— Cooling: To give best access to cold air inlet coming from the floor.
— Serviceability: To allow ease of access during service, as the system modules are
accessible from the top.
• Check and install thermal barriers, special baffling or direct ducting if possible to prevent hot
aisle air recirculating into the cold aisles, raising inlet temperatures and therefore, raising the
temperature of Memory Arrays.
• To the greatest extent possible, remove airflow obstructions from the intake and exhaust
openings of the Memory Arrays mounted in the rack. Thus, proper cable management
technique is recommended. It is recommended that data and power cables be grouped when
routing and tying.
Tying power cables at the bottom of the cable management arm and tying data cables at the
top of the cable management arm help minimize airflow restriction.
• Chilled air is pulled through the front and exhausted through the rear by the fans in the
Memory Arrays. Recirculation of hot air exiting the back of the rack into the front of the rack
should be eliminated as much as possible.
Install blanking/filler plates to all empty “U” slots in the racks to prevent both cold air from
bypassing server inlets and to avoid exhaust air from recirculating back to the inlets.
• The recommended operating temperature ranges for data centers—according to ASHRAE
(American Society of Heating, Refrigeration and Air-Conditioning)—is 64.4°F (18°C) for low-
end and 80.6°F (27°C) for high-end. When deploying multiple Memory Arrays in the same
rack, you should monitor ambient and inlet temperature rise and may wish to adjust AC
settings in the data center to provide appropriate temperature levels. Violin Memory
recommends that the ambient temperature be maintained at around 25°C.
• As an optional but not necessary practice, you could consider racking Memory Arrays with 1U
separation to reduce exhaust airflow restrictions and to enable ease of cable management.
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