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Amp-HI: The current high limit that will cause a failure if exceeded during a RUN test.
Amp-LO: The current low limit that will cause a failure if not exceeded during a RUN
test.
Power-HI: The power high limit that will cause a failure if exceeded during a RUN test.
Power-LO: The power low limit that will cause a failure if not exceeded during a RUN
test.
PF-HI: The power factor high limit that will cause a failure if exceeded during a RUN
test.
PF-LO: The power factor low limit that will cause a failure if not exceeded during a
RUN test.
Current: The Current that is applied between the Current and Return lead during a
ground bond test.
Current-HI: The maximum allowable current-flow through the DUT that triggers a
failure when exceeded.
Current-LO: The minimum allowable current-flow through the DUT triggers a failure
when not exceeded.
Leakage-HI: The maximum leakage current allowable through the measuring device
that triggers a failure when exceeded.
Leakage-LO: The minimum leakage current allowable through the measuring device
that triggers a failure when not exceeded.
HI-Limit: A maximum threshold set point that when exceeded triggers a failure. A “T”
or an “R” designator is shown in AC withstand parameters and means, “T” total
current or “R” real current.
LO-Limit: A minimum threshold set point that when not exceeded triggers a failure. A
“T” or an “R” designator is shown in AC withstand parameters and means, “T” total
current or “R” real current.
Ramp Up: The length of time that is allowed for the test voltage to climb from 0 to the
programmed test voltage.
Dwell Time: The length of time that is allowed for the programmed test voltage to be
applied.
Delay Time: The length of time that the programmed test voltage is applied but no
judgment of the set parameters is made. Judgment of the parameters is not made
until the end of the delay time.
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