HPE ProLiant ML30

Acronyms and abbreviations
3DS TSV
three-dimensional stacked through-silicon via (integrated circuit packaging technology)
AHS
Active Health System
API
application program interface
CAS
column address strobe
CSR
customer self repair
DDR4
double data rate-4
EMI shield
Electromagnetic shield
FCoE
Fibre Channel over Ethernet
GPU
graphics processing unit
HPE SSA
HPE Smart Storage Administrator
iLO
Integrated Lights-Out
IML
Integrated Management Log
ISO
International Organization for Standardization
LFF
large form factor
LRDIMM
load reduced dual in-line memory module
LTO
linear tape-open
PCA
printed circuit assembly
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