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Huawei ATN 950B User Manual

Huawei ATN 950B
135 pages
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ATN 950B Multi-service Access Equipment
V200R001C02
Hardware Description
Issue 03
Date 2012-07-23
HUAWEI TECHNOLOGIES CO., LTD.

Table of Contents

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Huawei ATN 950B Specifications

General IconGeneral
Storage Temperature-40°C to 70°C
Relative Humidity5% to 95% (non-condensing)
MTBF200, 000 hours
Ports4 x 10GE SFP+
Switching Capacity240 Gbps
Dimensions (H x W x D)44 mm x 442 mm x 420 mm
Operating Temperature-40°C to 65°C

Summary

1 Overview

1.1 Appearance of the Device

Describes the physical appearance and installation options of the ATN 950B.

1.2 Slot Allocation

Details the slot allocation for boards within the ATN 950B chassis.

1.3 Boards and Valid Slots

Lists supported boards and their valid slot assignments in the ATN 950B.

1.4 System Architecture

Explains how boards work together to provide equipment functions.

1.5 Technical Specifications

Presents physical and environmental specifications of the ATN 950B.

2 Power Supply System

2.1 Power Supply System Structure

Details the DC and AC power supply structures and backup mechanisms.

2.2 PIU - Power Interface Board

Describes the PIU board, its functions, and specifications.

2.3 EPS30-4815AF External AC Power Supply System

Covers the EPS30-4815AF external AC power supply system.

3 Heat Dissipation System

3.1 System Air Channel

Describes the air flow direction for heat dissipation in the ATN 950B.

3.2 FAN - Fan Board

Details the AND1FAN, a fan board, including its functions and specifications.

4 AND1CXPA/AND1CXPB - System Control, Cross-connect, and Multi-protocol Process Unit

4.1 Overview

Introduces the CXPA/CXPB board, its role, and housing.

4.2 Functions and Features

Lists the key functions and features of the CXPA/CXPB board.

4.3 Working Principle and Signal Flow

Explains the internal modules and signal flow of the CXPA/CXPB board.

4.4 Front Panel

Describes the indicators, buttons, and interfaces on the CXPA/CXPB front panel.

4.5 CF Card and DIP Switch

Details the CF card and DIP switch functionalities on the CXPA/CXPB.

4.6 Technical Specifications

Provides dimensions, weight, and power consumption of the CXPA/CXPB.

5 Physical Interface Card

5.1 AND1EM4T - 4 Channels GE/FE Electrical Interface Board

Describes the AND1EM4T board: functions, principle, front panel, specs.

5.2 AND1EM8T - 8 Channels GE/FE Electric Interface Board

Details the AND1EM8T board: functions, principle, front panel, specs.

5.3 AND1EM4F - 4 Channels GE/FE Optical Interface Board

Describes the AND1EM4F board: functions, principle, front panel, specs.

5.4 AND1EM8F - 8 Channels GE/FE Optical Interface Board

Details the AND1EM8F board: functions, principle, front panel, specs.

5.5 AND1EX1 - 1 Channel 10 GE Optical Interface Board

Describes the AND1EX1 board: functions, principle, front panel, specs.

5.6 AND1ML1/AND1ML1A - 16 Channels E1 Electrical Interface Board

Details the AND1ML1/ML1A boards: functions, principle, front panel, specs.

5.7 AND3ML1A/AND3ML1B - 16 Channels E1 Interface Board

Describes the AND3ML1A/ML1B boards: functions, principle, front panel, specs.

5.8 AND2MD1A/AND2MD1B - 32 Channels E1 Interface Board

Details the AND2MD1A/MD1B boards: functions, principle, front panel, specs.

6 Filler Panel

6.1 Functions and Features

Explains the function of filler panels for shielding and ventilation.

6.2 Appearance and Valid Slots

Describes the appearance and valid slot locations for filler panels.

7 Pluggable Optical Modules

7.1 Appearance and Application

Covers the appearance and application of eSFP optical modules.

7.2 Optical Module Labels

Explains the purpose of optical module labels for identification.

9 Cables

9.1 Power Supply Cables and Grounding Cables

Details power supply and grounding cables for the ATN 950B.

9.2 Management Cables

Describes Ethernet cables used for NM signals.

9.3 Clock Cables

Covers external clock cables and 120-to-75-ohm clock cables.

9.4 Service Cables

Lists Ethernet, 75-ohm E1, and 120-ohm E1 service cables.

9.5 Fibers

Describes types of fibers and fiber connectors.

10 Safety Labels

10.1 Label Description

Lists and describes various safety labels on the chassis and boards.

10.2 Label Position

Shows the locations of labels on the ATN 950B chassis.

11 Indicators

11.1 Boards and Their Indicators

Lists indicators for different boards of the ATN 950B.

11.2 Description of the Board Status Indicator (STAT)

Explains the STAT indicator states and their meanings.

11.3 Description of the Program Running Indicator (PROG)

Explains the PROG indicator states and their meanings.

11.4 Description of the Critical Alarm Indicator (CRIT)

Explains CRIT indicator states and their meanings.

13 Interface Specifications

13.1 Technical Specifications of the GE and FE Optical Interfaces

Details technical specs for GE and FE optical interfaces.

13.2 Technical Specifications of FE and GE Electrical Interfaces

Details technical specs for FE and GE electrical interfaces.

13.3 Technical Specifications of the 10 GE Interfaces

Details technical specs for 10GE optical interfaces.

13.4 Technical Specifications of E1 Electrical Interfaces

Details technical specs for E1 electrical interfaces.

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