3 Heat Dissipation System
About This Chapter
The heat dissipation system is responsible for the heat dissipation of the entire device. Heat
generated by the boards is dissipated through the heat dissipation system. In this manner, the
temperatures of the components on the boards are controlled within a normal range, enabling
the boards to work stably.
3.1 System Air Channel
ATN 950B dissipates heat by blowing air in a left-to-right direction.
3.2 FAN - Fan Board
This section describes the AND1FAN, a fan board, in terms of the overview, functions, features,
working principle, front panel, and technical specifications.
ATN 950B Multi-service Access Equipment
Hardware Description 3 Heat Dissipation System
Issue 03 (2012-07-23) Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
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