Huawei FusionServer Pro XH321 V5 - Operating Temperature Limitations (Different Models of Processors)

A.2.4 Operating Temperature Limitations (Dierent Models of
Processors)
Table A-5 Operating temperature
specications (dierent models of processors)
Drive
Backplane
Processor
Model
Heat Sink Drive and
Memory
Conguratio
n
Max. Air
Inlet
Temperature
X6000 V5 C00
24 x 2.5" SAS
backplane
Intel
®
Xeon
®
Scalable
(Skylake and
Cascade Lake)
processor (P ≤
165 W)
a
Narrow
conjoined
heat sinks
● Drives ≤ 24
● DIMMs ≤
16
35°C (95°F)
X6000 V5 C00
24 x 2.5
NVMe
backplane
Intel
®
Xeon
®
Scalable
(Skylake and
Cascade Lake)
processor (P ≤
165 W)
a
Narrow
conjoined
heat sinks
● Drives ≤ 24
● DIMMs ≤
16
35°C (95°F)
X6000 V5 C10
24 x 2.5"
NVMe
backplane
Intel
®
Xeon
®
Scalable
(Skylake and
Cascade Lake)
processor
(165 W < P ≤
205 W)
Wide
conjoined
heat sinks
● 0 < drives
≤ 8
● DIMMs ≤
12
30°C (86°F)
Intel
®
Xeon
®
Scalable
(Skylake and
Cascade Lake)
processor (P ≤
165 W)
Narrow
conjoined
heat sinks
● Drives ≤ 24
● DIMMs ≤
16
35°C (95°F)
Wide
conjoined
heat sinks
b
● 0 < drives
≤ 8
● DIMMs ≤
12
30°C (86°F)
X6000 V5 C10
24 x 2.5" SAS
backplane
Intel
®
Xeon
®
Scalable
(Skylake and
Cascade Lake)
processor
(165 W < P ≤
205 W)
Wide
conjoined
heat sinks
● 8 < drives
≤ 16
● DIMMs ≤
12
30°C (86°F)
● 0 < drives
≤ 8
● DIMMs ≤
12
35°C (95°F)
FusionServer Pro XH321 V5 Server Node
Maintenance and Service Guide A Appendix
Issue 17 (2021-03-09) Copyright © Huawei Technologies Co., Ltd. 163