Removing the CMOS battery .......496
Installing the CMOS battery .......497
Removing the compute node cover .....498
Installing the compute node cover .....500
Removing a DIMM ..........501
Installing a DIMM...........502
Removing the front handle ........517
Installing the front handles ........518
Removing the hard disk drive backplane . . . 519
Installing the hard disk drive backplane . . . 521
Removing a hot-swap hard disk drive ....522
Installing a hot-swap hard disk drive ....523
Removing an I/O expansion adapter ....524
Installing an I/O expansion adapter .....525
Removing the light path diagnostics panel . . 526
Installing the light path diagnostics panel . . . 527
Removing the USB flash drive.......527
Installing the USB flash drive .......528
Removing and replacing Tier 2 customer
replaceable units (CRUs) .........529
Removing the base assembly .......529
Installing the base assembly .......531
Removing the chassis bulkhead ......533
Installing the chassis bulkhead ......534
Removing the hard disk drive cage .....535
Installing the hard disk drive cage .....536
Removing a fabric connector .......537
Installing a fabric connector .......538
Removing a microprocessor and heat sink . . . 539
Installing a microprocessor and heat sink . . . 542
Thermal grease ............551
Removing a microprocessor-retention assembly 552
Installing a microprocessor-retention assembly 553
Appendix. Getting help and technical
assistance.............555
Before you call .............555
Using the documentation .........556
Getting help and information from the World Wide
Web................556
How to send DSA data to IBM .......556
Creating a personalized support web page . . . 556
Software service and support ........557
Hardware service and support .......557
IBM Taiwan product service ........557
Notices ..............559
Trademarks ..............559
Important notes ............560
Particulate contamination .........561
Documentation format ..........562
Telecommunication regulatory statement ....562
Electronic emission notices .........562
Federal Communications Commission (FCC)
statement..............562
Industry Canada Class A emission compliance
statement..............563
Avis de conformité à la réglementation
d'Industrie Canada ..........563
Australia and New Zealand Class A statement 563
European Union EMC Directive conformance
statement..............563
Germany Class A statement .......563
Japan VCCI Class A statement.......564
Japan Electronics and Information Technology
Industries Association (JEITA) statement . . . 565
Korea Communications Commission (KCC)
statement..............565
Russia Electromagnetic Interference (EMI) Class
A statement .............565
People's Republic of China Class A electronic
emission statement ..........565
Taiwan Class A compliance statement ....565
Index ...............567
iv
IBM Flex System x440 Compute Node Types 7917 and 2584: Installation and Service Guide