Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide 5
A-12 Baseboard Keepout Footprint Definition and
Height Restrictions for Enabling Components (Sheet 5 of 6)....................................63
A-13 Baseboard Keepout Footprint Definition and
Height Restrictions for Enabling Components (Sheet 6 of 6)....................................64
A-14 1U CEK Heatsink (Sheet 1 of 4)...........................................................................65
A-15 1U CEK Heatsink (Sheet 2 of 4)...........................................................................66
A-16 1U CEK Heatsink (Sheet 3 of 4)...........................................................................67
A-17 1U CEK Heatsink (Sheet 4of 4)............................................................................ 68
A-18 Active CEK Thermal Solution Volumetric (Sheet 1 of 3)...........................................69
A-19 Active CEK Thermal Solution Volumetric (Sheet 2 of 3)...........................................70
A-20 Active CEK Thermal Solution Volumetric (Sheet 3 of 3)...........................................71
B-1 Load Cell Installation in Machined Heatsink Base Pocket -- Bottom View ...................74
B-2 Load Cell Installation in Machined Heatsink Base Pocket -- Side View ....................... 75
B-3 Preload Test Configuration..................................................................................75
Tables
1-1 Reference Documents..........................................................................................7
1-2 Terms and Descriptions........................................................................................8
2-1 Processor Mechanical Parameters Table................................................................11
2-2 Input and Output Conditions for the
Dual-Core Intel Xeon Processor 5100 Series Thermal Management Features.............. 19
2-3 Processor Core Geometric Center Dimensions .......................................................20
2-4 Intel Reference Heatsink Performance Targets for the
Dual-Core Intel® Xeon® Processor 5148 .............................................................27
2-5 Intel Reference Heatsink Performance Targets for the
Dual-Core Intel Xeon Processor 5110/5120/5130/5140/5150.................................. 28
2-6 Intel Reference Heatsink Performance Targets for the
Dual-Core Intel Xeon Processor 5160................................................................... 29
2-7 Fan Speed Control, TCONTROL and DTS Relationship .............................................30
2-8 CEK Heatsink Thermal Mechanical Characteristics ..................................................44
2-9 Recommended Thermal Grease Dispense Weight................................................... 45
2-10 Fan Specifications (Boxed 4-wire PWM/DTS Heatsink Solution)................................48
2-11 Fan Cable Connector Pin Out (Active CEK) ............................................................48
A-1 Mechanical Drawing List..................................................................................... 51
B-1 Typical Test Equipment ......................................................................................76
D-1 Use Conditions Environment ...............................................................................82
E-1 Suppliers for the Dual-Core Intel Xeon Processor 5100 Series
Intel Reference Solution.....................................................................................85
E-2 Suppliers of Alternative Thermal Solutions for the
Dual-Core Intel Xeon Processor 5100 Series.......................................................... 86
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