Table of Contents Intel® Server Board SE7520BD2 Technical Product Specification
vi Revision 1.3
4.7.1 Front Panel............................................................................................................112
5. Error Reporting and Handling.........................................................................................115
5.1 Error Propagation......................................................................................................115
5.2 Fault Resilient Booting (FRB)....................................................................................115
5.2.1 FRB-3 – BSP Reset Failures.................................................................................115
5.2.2 FRB-2 – BSP POST Failures ................................................................................115
5.2.3 FRB-1 – BSP Self-Test Failures............................................................................116
5.2.4 OS Boot Timer - OS Load Failures .......................................................................116
5.2.5 Application Processor (AP) Failures......................................................................116
5.2.6 Treatment of Failed Processors ............................................................................116
5.3 Error Messages and Error Codes..............................................................................117
5.3.1 POST Error Codes and Messages........................................................................117
5.3.2 POST Error Beep Codes.......................................................................................119
5.3.3 Checkpoints...........................................................................................................120
5.4 Error Logging.............................................................................................................122
5.4.1 Error Sources and Types ......................................................................................122
5.4.2 SMI Handler ..........................................................................................................123
5.4.3 Logging Format Conventions ................................................................................124
5.4.4 POST Code Checkpoints ......................................................................................128
5.4.5 Boot Block Initialization Code Checkpoints...........................................................130
5.4.6 Boot Block Recovery Code Checkpoint ................................................................131
5.4.7 DIM Code Checkpoints .........................................................................................132
5.4.8 Single-bit ECC Error Throttling Prevention............................................................132
5.5 Reliability, Availability and Serviceability (RAS) Features.........................................133
5.5.1 Memory RAS features...........................................................................................133
5.5.2 PCI Express ..........................................................................................................133
5.5.3 RAS Features of FSB............................................................................................134
5.5.4 PCI-X.....................................................................................................................134
5.5.5 RMC Connector Utilization....................................................................................134
5.5.6 Rolling BIOS..........................................................................................................135
6. Connector Pin-outs and Jumper Blocks........................................................................136
6.1 Board Connector Pin-outs.........................................................................................136
6.2 Board Jumper Blocks ................................................................................................142
6.2.1 Rolling BIOS Bank Selection Jumper....................................................................142
6.2.2 BIOS Recovery......................................................................................................142
6.2.3 Password Clear.....................................................................................................142
6.2.4 CMOS Clear..........................................................................................................143
7. Environmental Specifications.........................................................................................144
7.1 Environmental Specifications and Cooling Requirements.........................................144
7.2 Power Supply Requirements.....................................................................................145
7.2.1 Baseboard Power Budget .....................................................................................145