8.2.1. PREPARATION
8.2.1.1. For Power Supply Board
- SOLDER
Sparkle Solder 115A-1, 115B-1 OR Almit Solder KR-19, KR-19RMA
- Soldering iron
Recommended power consumption is between 30 W to 40 W.
Temperature of Copper Rod 662 ± 50°F (350 ± 10°C)
(An expert may handle a 60~80 W iron, but a beginner might
damage the foil by overheating.)
- Flux
HI115 Specific gravity 0.863
(Original flux should be replaced daily.)
8.2.1.2. For P.C.Board with “PbF” marking
- PbF (: Pb free) Solder
- Soldering Iron
Tip Temperature of 700°F ± 20°F (370°C ± 10°C)
Note: We recommend a 30 to 40 Watt soldering iron. An expert
may be able to use a 60 to 80 Watt iron where someone with less
experience could overheat and damage the PCB foil.
- Flux
Recommended Flux: Specific Gravity 0.82.
Type RMA (lower residue, non-cleaning type)
Note: See ABOUT LEAD FREE SOLDER (PbF: Pb free) ().
8.2.2. FLAT PACKAGE IC REMOVAL PROCEDURE
1. Put plenty of solder on the IC pins so that the pins can be
completely covered.
Note:
If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the
pins with a cutter.
194
To Next Page
Loading...
