5 Mounting
5.1 Mounting instructions
•
The device must be mounted in such a way that it is ensured during operation that
all specified values are adhered to and not exceeded.
•
Mount the device using the optionally available assembly accessories, see "Acces‐
sories", page 15.
•
Mount the device on a prepared bracket.
•
The device should be mounted and operated as free from shock and vibration as
possible.
•
The device can be mounted in any position depending on the application purpose.
•
Mount the device so that it is not exposed to direct sunlight (window, skylight)
or other sources of heat. This prevents the temperature inside the device from
increasing unacceptably, or a reduction or loss of detection capability.
•
During mounting, make sure there is no reflective surface behind the internal
reference target, see "Setup and dimensions", page 14. In general, to prevent
a reduction or loss of detection capability, the mounting position of the device
should be chosen so as to exclude any dazzle in the sensor’s back area (behind
the internal reference target) due to other light sources.
•
When mounting the device, make sure the swivel connector area is recessed so it
does not lie on the mounting surface see "Setup and dimensions", page 14.
•
Avoid having shiny or reflective surfaces in the scanning range, e.g., stainless
steel, aluminum, glass, reflectors, or surfaces with these types of coatings.
5.2 Mutual interference
NOTE
Optical sensors and other IR light sources can influence the measurement and detec‐
tion capabilities of the device.
The device has been designed to minimize the probability of mutual interference with
devices of the same type. To rule out even the slightest effects on the measurement
accuracy, the devices should be arranged such the laser beams are not received by
another device.
Figure 4: Angle ≥ 6°
MOUNTING
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8022483/1LM2/2024-03-27 | SICK O P E R A T I N G I N S T R U C T I O N S | TiM361S
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Subject to change without notice