Sony HCD-DX50 User Manual

MHC-DX50/RG80
Canadian Model
MHC-RG80
Australian Model
E Model
MHC-DX50
SERVICE MANUAL
MINI Hi-Fi COMPONENT SYSTEM
Sony Corporation
Audio Entertainment Group
General Engineering Dept.
Ver 1.0 2001. 02
9-929-588-11
2001B1600-1
© 2001.2
COMPONENT MODEL NAME
• MHC-DX50/RG80 are composed of following models.
As for the service manual, it is issued for each component model,
then, please refer to them.
REAR SPEAKER
SYSTEM
COMPACT DISC DECK
RECEIVER SYSTEM
FRONT SPEAKER
SYSTEM
PARTS LIST
Part No. Description Remark
ACCESSORIES & PACKING MATERIALS
********************************
1-476-503-11 REMOTE COMNDUDER (RM-SR210)
1-501-374-11 ANTENNA, LOOP
1-501-659-71 ANTENNA, (FM)
4-210-254-41 CUSHION (FOOT)
4-223-953-01 COVER, BATTERY (FOR RM-SR210)
4-232-650-11 INSTRUCTION MANUAL ( DX50 : AUS, E2, E51, MX,SP/RG80)
(ENGLISH)
4-232-650-21 INSTRUCTION MANUAL (DX50 : E2, SP/RG80)(FRENCH)
4-232-650-31 INSTRUCTION MANUAL (DX50 : E2, E51, MX, SP)(SPANISH)
4-232-650-41 INSTRUCTION MANUAL (DX50 : SP)(CHINESE)
4-232-650-71 INSTRUCTION MANUAL (DX50 : KR)(KOREAN)
MHC-RG80
HCD-RG80
SS-DX50
SS-RS50
MHC-DX50
HCD-DX50
SS-DX50
• Abbreviation
E2 : 120 V AC Area in E model
E51 : Chilean and peruvian model
SP : Singapore model
MX : Mexican model
AUS : Australian model
KR : Korea model
SPECIFICATIONS

Sony HCD-DX50 Specifications

General

Brand	Sony
Model	HCD-DX50
Category	Stereo System
Language	English

Summary

Specifications

Amplifier Section Specifications

Specifications for the amplifier section, including power output and input/output details.

Safety and Handling Precautions

Optical Pick-up and Laser Diode Handling

Precautions for handling the optical pick-up block and laser diode emission.

Component and Circuit Board Repair Safety

Guidelines for replacing chip components and repairing flexible circuit boards.

Safety Check-out Procedures

AC Leakage Measurement

Procedure for checking AC leakage current from exposed metal parts to ground.

Basic Operation and Setup

Section 2 Disassembly Procedures

Upper Case (Top) Removal

Procedure for removing the upper case from the main unit.

Loading Panel Assembly Removal

Steps for disassembling and removing the loading panel assembly.

Front Panel Section Disassembly

Procedure for disassembling the front panel section of the unit.

Panel Board Removal

Instructions for removing the panel board.

Sub Trans and Main Trans Board Removal

Main Board and Power Board Removal

Leaf SW, Head (A), and Head (B) Board Removal

Base Unit Disassembly

Driver, Motor, and Address Sensor Board Removal

Section 3 Test Mode Operations

Resets and Tuner Step Configuration

Procedures for cold/hot resets and changing tuner AM channel steps.

Function and GC Test Mode

Selecting external inputs and using GC test mode for system checks.

MC Test Mode Functions

Checking amplifier, tuner, and tape section operations in MC test mode.

Tape and CD Test Modes

VACS and CD Service Mode

Section 4 Mechanical Adjustments

Torque Measurement Procedures

Section 5 Electrical Adjustments

Deck Section Adjustment Precautions

General precautions and settings for deck section electrical adjustments.

Head Azimuth and Tape Speed Adjustments

Adjusting head azimuth and tape speed for deck sections.

Playback Level Adjustment

Adjusting playback level for Deck A and Deck B using a level meter.

Record Bias and Level Adjustment

Adjusting record bias and record level for Deck B.

Tuner Section Adjustments

FM Tuned Level and Null Adjustment

CD Section Adjustments

S-Curve and RF Level Checks

E-F Balance (1 Track Jump) Check

Section 7 Exploded Views

Cabinet Section Exploded View

Front Panel Section Exploded View

Main Board Section Exploded View

Mechanism Sections Exploded Views

Section 8 Electrical Parts List

BD Section Parts

Main Section Parts List

Panel Section Parts List

Power, Sensor, Sub Trans, and Switch Section Parts

Exploded View and Parts List