FN990
Family Hardware Design Guide
1VV0301752 Rev. 3 Page 21 of 92 2022-10-07
Not Sub
ect to NDA
Mode Temperature Note
from the 3GPP specification on the receiver or
the maximum output power may be slightly
degraded. Even so, all functionalities, such as
connection to calls, SMS, USB communication,
UART activation and so on, will be maintained,
and the effect of such degradations will not
lead to malfunctions.
Storage and non-operating
Temperature Range
–40°C ~ +85°C
Table 12: Temperature Range
Warning: The application processor temperature which is in the
FN990 Family must be kept below 95 degC for the best performance.
Depending on the various application, a heat sink, thermal pad or
other cooling system may be required to properly dissipate the heat.
A large solder resist opening area is located on the bottom side of
the module. Adding a TIM on that area with a heatsink is one of the
best way to dissipate the heat well. The temperature can be read via
AT commands. For more details, please refer to SW user guide or
thermal design guideline.
2.8.2. RoHS Compliance
As a part of the Telit corporate policy of environmental protection, the FN990 Family
products comply with the RoHS (Restriction of Hazardous Substances) directive of the
European Union (EU directive 2011/65/EU).
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