FN990
Family Hardware Design Guide
1VV0301752 Rev. 3 Page 67 of 92 2022-10-07
Not Sub
ect to NDA
Figure 23: Solder Resist Opening Area and Keep Out Area on Bottom Side
In order to guarantee performance and longevity of the end product, the heat generated
by the FN990 module must be dissipated.
A large solder resist opening area (30*41.7 mm) is provided on the bottom of the FN990
modems for better heat dissipation. The addition of a TIM on the back of the FN990
Family is the most important factor from the thermal dissipation point of view.
The recommended TIM size is 29 x 38 x 1.5 mm .
Warning: The keep out area (30*2.27 mm) on the bottom side is only
for debugging purposes. Please do not use this area for hardware
design.
Note: For more information on thermal design, refer to the FN990
Family Thermal Design Guide.
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