Texas Instruments MSPM0G350 Series User Manual

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PACKAGE OUTLINE
C
48X
0.30
0.18
4.1 0.1
48X
0.5
0.3
1 MAX
(0.2) TYP
0.05
0.00
44X 0.5
2X
5.5
2X 5.5
B
7.15
6.85
A
7.15
6.85
VQFN - 1 mm max height
RGZ0048B
PLASTIC QUAD FLATPACK - NO LEAD
4218795/B 02/2017
PIN 1 INDEX AREA
0.08 C
SEATING PLANE
1
12
25
36
13 24
48
37
(OPTIONAL)
PIN 1 ID
0.1 C B A
0.05
EXPOSED
THERMAL PAD
49
SYMM
SYMM
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
SCALE 2.000

Texas Instruments MSPM0G350 Series Specifications

General

Brand	Texas Instruments
Model	MSPM0G350 Series
Category	Motherboard
Language	English