Texas Instruments MSPM0G350 Series User Manual

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PACKAGE OUTLINE
C
32X
0.3
0.2
3.45 0.1
32X
0.5
0.3
1 MAX
(0.2) TYP
0.05
0.00
28X 0.5
2X
3.5
2X 3.5
A
5.1
4.9
B
5.1
4.9
(0.1)
VQFN - 1 mm max height
RHB0032E
PLASTIC QUAD FLATPACK - NO LEAD
4223442/B 08/2019
PIN 1 INDEX AREA
0.08 C
SEATING PLANE
1
8
17
24
9
16
32
25
(OPTIONAL)
PIN 1 ID
0.1 C A B
0.05 C
EXPOSED
THERMAL PAD
33
SYMM
SYMM
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
SCALE 3.000
SEE SIDE WALL
DETAIL
20.000
SIDE WALL DETAIL
OPTIONAL METAL THICKNESS

Texas Instruments MSPM0G350 Series Specifications

General

Brand	Texas Instruments
Model	MSPM0G350 Series
Category	Motherboard
Language	English