Texas Instruments MSPM0G350 Series User Manual

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EXAMPLE STENCIL DESIGN
32X (0.6)
32X (0.25)
28X (0.5)
(4.8)
(4.8)
4X ( 1.49)
(0.845)
(0.845)
(R0.05) TYP
VQFN - 1 mm max height
RHB0032E
PLASTIC QUAD FLATPACK - NO LEAD
4223442/B 08/2019
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
33
SYMM
METAL
TYP
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 33:
75% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:20X
SYMM
1
8
9
16
17
24
25
32

Texas Instruments MSPM0G350 Series Specifications

General

Brand	Texas Instruments
Model	MSPM0G350 Series
Category	Motherboard
Language	English