Assembly of outside Tape and Cover shield
1. Assembly of Cover shield (S).
CAUTION: Pressure or stress should not be given on Source PCB.
Usage of gloves with anti-electric discharge coating is recommended.
To eliminate possible damage on circuits occurred by ESC.
2. Assembly of Cover shield (G).
CAUTION: Pressure or stress should not be given on Gate TCP.
3. Assembly of Tape Adhesive used for Top case fixing.
Assembly of Tape Adhesive used for B/L Wire fixing.
CAUTION: Pressure or stress should not be given on Top case during this process.
Figure 4-64 Replacing LG.Philips fluorescent lamp (XGA) (8)
TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL] 4-84
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