Assembly of outside Tape and Cover shield
1. Assembly of Cover shield (S).
CAUTION: Pressure or stress should not be given on Source PCB.
Usage of gloves with anti-electric discharge coating is recommended.
To eliminate possible damage on circuits occurred by ESC.
2. Assembly of Cover shield (G).
CAUTION: Pressure or stress should not be given on Gate COF.
3. Assembly of Tape Adhesive used for Top case fixing.
CAUTION: Pressure or stress should not be given on Top case during this process.
4. Assembly of Tape Adhesive used for B/L Wire fixing.
CAUTION: Pressure or stress should not be given on B/L Wire.
Figure 4-99 Replacing LG Philips fluorescent lamp (SXGA+) (8)
TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL] 4-121
To Next Page
Loading...
