3-1
Section 3 MS2667C
3.1 Overall Circuit description ......................................................... 3-2
3.2 Troubleshooting......................................................................... 3-9
3.2.1 Introduction .................................................................... 3-9
3.2.1.1 Service kit ......................................................... 3-9
3.2.1.2 Required equipment ......................................... 3-9
3.2.1.3 Circuit reference ............................................... 3-10
3.2.2 Detecting faulty module ................................................. 3-15
3.2.3 Disassembling cabinet................................................... 3-16
3.2.4 Replacement of faulty module ....................................... 3-16
3.2.5 Adjustment after module replacement ........................... 3-16
3.2.5.1 Reference crystal oscillator adjustment .......... 3-16
3.2.5.2 Sweep adjustment .......................................... 3-16
3.2.5.3 IF Gain-1 (ATT), IF Gain-2 (AMP) of Internal
Mixer Band adjustment.................................... 3-26
3.2.5.4 IF Gain-1 (ATT), IF Gain-2 (AMP) of External
Mixer Band adjustment.................................... 3-30
3.2.6 Assembling cabinet........................................................ 3-32
3.2.7 Checking items after assembling cabinet ...................... 3-32
3.2.8 Frequency response compensation .............................. 3-32
3.3 Mechanical configuration........................................................... 3-33
3.3.1 Disassembling/Assembling cabinet ............................... 3-33
3.3.2 Removing/Assembling units and PC boards ................. 3-37
3.3.3
Disassembling/Assembling Components around RF Input .....
3-41
3.3.4 Disassembling/Assembling Units and Components on
lower surface ................................................................. 3-45
3.3.5 Front unit disassembly/assembly................................... 3-51
3.3.6 OPTION BASE disassembly/assembly ......................... 3-55
3.3.7 Removing/Assembling A0501 HI-SPEED AD
from SCAN/AD............................................................... 3-59
3.3.8 Connecting the cable to Diplexing Bandswitch
and F2626 (YTF) ........................................................... 3-60