Pin Name Module Connector Pins Voltage Maximum Comment
Current
19
VCC_3V3
A-26, 29, 50, 86
3.3 V ±5%
4 A
Always active
B-55, 79, 115, 127, 152, 155 (and max 0.3 A
C-96, 103, 136, 143 per pin)
VCC_2V5 A-53, 62, 65, 89 2.5 V ±5% 0.25 A Controlled by PWR_EN
20
VCC_1V8
B-52, 76, 108, 128
1.8 V ±5% 1 A Controlled by PWR_EN
C-83, 123, 165
Table 18: Voltage Supply Outputs
20
Warning!
Do not connect any power supply to the voltage supply outputs nor short circuit them to GND, as this
may damage the Mercury+ XU1 SoC module.
2.11.5 Power Consumption
Please note that the power consumption of any MPSoC device strongly depends on the application (on the
configured bitstream and I/O activity).
To estimate the power consumption of your design, please use the Xilinx Power Estimator available on the
Xilinx website.
2.11.6 Heat Dissipation
High performance devices like the Xilinx Zynq Ultrascale+ MPSoC need cooling in most applications; always
make sure the MPSoC is adequately cooled.
Table 19 lists the heat sink and thermal pad part numbers that are compatible with the Mercury+ XU1 SoC
module. Details on these parts and additional information that may assist in selecting a suitable heat sink
for the Mercury+ XU1 SoC module can be found in the Enclustra Modules Heat Sink Application Note [18].
Product Name Package Name Heat Sink Part Number Thermal Pad Part Number
Mercury+ XU1 FFVC900 [24] ATS-52310G-C1-R0 TG6050-30-30-1
Table 19: Heat Sink Type
Please note that the provided parts are recommended for prototyping purposes. In cases where the module
in used in environments subject to vibrations, a heat sink with a clip may be required for optimal fixation.
19
The maximum available output current depends on your design. See sections 2.11.1 and 2.11.5 for details.
20
On revision 1 modules, the 2.5 V converter cannot be disabled via PWR_EN signal.
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