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Enclustra Mercury XU5 User Manual

Enclustra Mercury XU5
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Mercury XU5 SoC Module
User Manual
Purpose
The purpose of this document is to present the characteristics of Mercury XU5 SoC module to the user, and
to provide the user with a comprehensive guide to understanding and using the Mercury XU5 SoC module.
Summary
This document first gives an overview of the Mercury XU5 SoC module followed by a detailed description
of its features and configuration options. In addition, references to other useful documents are included.
Product Information Code Name
Product ME-XU5 Mercury XU5 SoC Module
Document Information Reference Version Date
Reference / Version / Date D-0000-445-001 07 25.07.2019
Approval Information Name Position Date
Written by DIUN Design Engineer 08.06.2018
Verified by GKOE, GLAC Design Expert 22.06.2018
Approved by DIUN Manager, BU SP 25.07.2019
Enclustra GmbH Räffelstrasse 28 CH-8045 Zürich Switzerland
Phone +41 43 343 39 43 www.enclustra.com

Table of Contents

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Enclustra Mercury XU5 Specifications

General IconGeneral
BrandEnclustra
ModelMercury XU5
CategoryControl Unit
LanguageEnglish

Summary

Overview

1.1 General and Safety

Covers general module information, safety precautions, warranty, RoHS compliance, and disposal guidelines.

1.2 Features

Detailed list of the Mercury XU5 SoC module's key hardware and software capabilities.

1.3 Deliverables and Accessories

Lists provided documentation, resources, reference designs, and related accessories for the module.

1.5 Xilinx Tool Support

Information regarding the Xilinx development tools supported for the module.

Module Description

2.1 Block Diagram

Hardware block diagram illustrating the Mercury XU5 SoC module architecture.

2.2 Module Configuration and Product Codes

Details on standard module configurations and their corresponding product codes.

2.3 Article Numbers and Article Codes

Explanation of module article numbers, serial number identification, and revision codes.

2.4 Module Views and Drawings

Visual representations and assembly drawings of the module's top and bottom sides.

2.6 Module Footprint and Mechanical Data

Module footprint dimensions for base board mounting and mechanical specifications.

2.8 Module Connector

Details on the Hirose FX10 module connectors, pin numbering, and types.

2.9 User I/O

Comprehensive information on user-accessible input/output pins and their conventions.

2.10 Multi-Gigabit Transceiver (MGT)

Overview of GTH and GTR transceivers, including their specifications and connectivity.

2.11 Power

Details on the module's power supply generation, inputs, outputs, and monitoring.

2.12 Clock Generation

Information on the module's clock sources, frequencies, and connections.

2.13 Reset

Details on the power-on reset (POR) and system reset (SRST) signals.

2.14 LEDs

Description of the user and status LEDs available on the module.

2.15 DDR4 SDRAM (PS)

Details on the DDR4 SDRAM connected to the Processing System (PS).

2.16 DDR4 SDRAM (PL)

Details on the DDR4 SDRAM connected to the Programmable Logic (PL).

2.17 QSPI Flash

Information on the Quad SPI flash memory for booting and data storage.

2.18 eMMC Flash

Details on the eMMC flash memory for booting and data storage.

2.19 SD Card

Interface details for connecting and operating an SD card.

2.20 Gigabit Ethernet (PS)

Details on the Gigabit Ethernet interface connected to the Processing System (PS).

2.21 Gigabit Ethernet (PL)

Details on the Gigabit Ethernet interface connected to the Programmable Logic (PL).

2.22 USB 2.0

Information on the USB 2.0 interfaces and their PHY types.

2.23 USB 3.0

Details on the built-in USB 3.0 controllers and their PHY interface.

2.24 Display Port

Information on the built-in DisplayPort controllers and their PHYs.

2.25 Real-Time Clock (RTC)

Functionality and access to the internal real-time clock (RTC).

2.26 Secure EEPROM

Details on the secure EEPROM for storing module configuration and data.

Device Configuration

3.1 Configuration Signals

Key configuration pins for MPSoC boot modes and FPGA configuration.

3.2 Pull-Up During Configuration

Configuration of pull-up resistors for FPGA I/Os during device configuration.

3.3 Power-on Reset Delay Override

Mechanism to override the PL power-on delay time to a default standard time.

3.4 Boot Mode

Selection of module boot modes using specific signals on the connector.

3.5 JTAG

Details on the JTAG interface for debugging, programming, and system testing.

3.6 eMMC Boot Mode

Operation of the module when booting from the on-board eMMC flash.

3.7 QSPI Boot Mode

Operation of the module when booting from the on-board QSPI flash.

3.8 SD Card Boot Mode

Operation of the module when booting from an SD card.

3.9 eMMC Flash Programming

Procedure for formatting and programming the eMMC flash memory.

3.10 QSPI Flash Programming via JTAG

Using JTAG for QSPI flash programming with Xilinx Vivado and SDK tools.

3.11 QSPI Flash Programming from an External SPI Master

Method for programming QSPI flash directly from an external SPI master.

3.12 Enclustra Module Configuration Tool

Using the Enclustra Module Configuration Tool (MCT) for QSPI flash programming.

I2C Communication

4.1 Overview

Overview of the I2C bus and its connections to MPSoC, EEPROM, and external devices.

4.2 Signal Description

Description of the I2C interface signals (SDA, SCL, INT#) and their connections.

4.3 I2C Address Map

Address map for various devices connected on the I2C bus.

4.4 Secure EEPROM

Details on the secure EEPROM for storing module configuration and data.

Operating Conditions

5.1 Absolute Maximum Ratings

Absolute maximum ratings for the Mercury XU5 SoC module components.

5.2 Recommended Operating Conditions

Recommended operating conditions for the module, including voltage and temperature ranges.

Ordering and Support

6.1 Ordering

Information and instructions for ordering the Mercury XU5 SoC module.

6.2 Support

Information on how to access technical support resources and documentation.

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