Warning!
Do not connect any power supply to the voltage supply outputs nor short circuit them to GND, as this
may damage the Mercury+ XU8 SoC module.
2.11.5 Power Consumption
Please note that the power consumption of any MPSoC device strongly depends on the application (on the
configured bitstream and I/O activity).
To estimate the power consumption of your design, please use the Xilinx Power Estimator available on the
Xilinx website.
2.11.6 Heat Dissipation
High performance devices like the Xilinx Zynq Ultrascale+ MPSoC need cooling in most applications; always
make sure the MPSoC is adequately cooled.
Table 18 lists the heat sink and thermal pad part numbers that are compatible with the Mercury+ XU8 SoC
module. Details on these parts and additional information that may assist in selecting a suitable heat sink
for the Mercury+ XU8 SoC module can be found in the Enclustra Modules Heat Sink Application Note [17].
Product Name Package Name Heat Sink Part Number Thermal Pad Part Number
Mercury+ XU8 FBVB900 [23] ATS-52310G-C1-R0 TG6050-30-30-1
Table 18: Heat Sink Type
Please note that the provided parts are recommended for prototyping purposes. In cases where the module
in used in environments subject to vibrations, a heat sink with a clip may be required for optimal fixation.
Warning!
Depending on the user application, the Mercury+ XU8 SoC module may consume more power than
can be dissipated without additional cooling measures; always make sure the MPSoC is adequately
cooled by installing a heat sink and/or providing air flow.
2.11.7 Voltage Monitoring
Several pins on the module connector on the Mercury+ XU8 SoC module are marked as VMON. These are
voltage monitoring outputs that may be used to measure some of the on-board voltages. Examples of such
monitoring circuits are available on Enclustra base boards.
It is not allowed to draw power from the voltage monitoring outputs.
Table 19 presents the VMON pins on the Mercury+ XU8 SoC module.
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