Fujitsu PRIMERGY TX100 S2 Service Supplement

Service Supplement TX100 S2
Contents
4.3 Replacing the front USB module . . . . . . . . . . . . . . . . 52
4.3.1 Removing the front USB cable . . . . . . . . . . . . . . . . . . 52
4.3.2 Installing the front USB module . . . . . . . . . . . . . . . . . . 55
4.4 Replacing the power supply unit . . . . . . . . . . . . . . . . 57
4.5 Replacing hard disk drives . . . . . . . . . . . . . . . . . . . 67
4.6 Replacing fans . . . . . . . . . . . . . . . . . . . . . . . . . . 72
4.6.1 Replacing the front fan module (system fan 1) . . . . . . . . . . 72
4.6.2 Replacing the rear fan module (system fan 2) . . . . . . . . . . 80
4.7 Replacing the processor . . . . . . . . . . . . . . . . . . . . 85
4.7.1 Removing the processor heat sink . . . . . . . . . . . . . . . . 85
4.7.2 Replacing the processor . . . . . . . . . . . . . . . . . . . . . 88
4.7.3 Installing the processor heat sink . . . . . . . . . . . . . . . . . 94
4.8 Replacing the system board . . . . . . . . . . . . . . . . . . 96
4.9 Replacing the Trusted Platform Module (TPM) . . . . . . . 104
4.10 Replacing the USB Flash Module (UFM) . . . . . . . . . . . 109
Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

Fujitsu PRIMERGY TX100 S2 Specifications

General

Tcase	72.7 °C
Bus type	DMI
Stepping	B1
FSB Parity	No
Processor code	SLBLJ
Processor cache	8 MB
Processor cores	4
Processor model	X3430
System bus rate	2.5 GT/s
Processor series	Intel Xeon 3400 Series
Processor socket	LGA 1156 (Socket H)
Processor codename	Lynnfield
Motherboard chipset	Intel® 3420
Processing Die size	296 mm²
Processor frequency	2.4 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	- MHz
Processor boost frequency	2.8 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
PCI Express configurations	1x16, 2x8, 4x4
Supported instruction sets	SSE4.2
Thermal Design Power (TDP)	95 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	18
Physical Address Extension (PAE)	36 bit
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3-SDRAM
Number of Processing Die Transistors	774 M
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	800, 1066, 1333 MHz
Memory bandwidth supported by processor (max)	21 GB/s
Maximum internal memory supported by processor	32 GB
HDD size	3.5 \
HDD interface	Serial ATA
Optical drive type	DVD-RW
Total storage capacity	1000 GB
Maximum storage capacity	4 TB
Number of HDDs installed	2
Memory slots	4x DIMM
Internal memory	4 GB
Memory clock speed	1333 MHz
Maximum internal memory	16 GB
Memory layout (slots x size)	2 x 2 GB
Maximum graphics card memory	64 MB
Graphics card	ES1000
LAN controller	Intel® 82578DM
Networking features	Gigabyte Ethernet
PS/2 ports quantity	0
USB 2.0 ports quantity	11
PCI Express slots version	2.0
Power supply	250 W
Power requirements	100 - 127 V, 200 - 240 V, 47 - 63 Hz
Power consumption (typical)	171 W
Noise level	24 dB
Operating system installed	-
Compatible operating systems	Windows Server 2008, Server 2003 Novell SUSE Linux Enterprise Server Red Hat Enterprise Linux
Operating temperature (T-T)	10 - 35 °C
Operating relative humidity (H-H)	10 - 85 %
Sustainability certificates	ENERGY STAR
Certification	GS CE CSAc/us ULc/us FCC CB RoHS WEEE
Chassis type	Tower
Processor ARK ID	42927
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Depth	386 mm
Width	203 mm
Height	390 mm
Weight	12000 g