HP 280 G3 User Manual

3 Routine care, SATA drive guidelines, and
disassembly preparation
This chapter provides general service information for the computer. Adherence to the procedures and
precautions described in this chapter is essential for proper service.
CAUTION: When the computer is plugged into an AC power source, voltage is always applied to the system
board. You must disconnect the power cord from the power source before opening the computer to prevent
system board or component damage.
Electrostatic discharge information
A sudden discharge of static electricity from your nger or other conductor can destroy static-sensitive
devices or microcircuitry. Often the spark is neither felt nor heard, but damage occurs. An electronic device
exposed to electrostatic discharge (ESD) may not appear to be aected at all and can work perfectly
throughout a normal cycle. The device may function normally for a while, but it has been degraded in the
internal layers, reducing its life expectancy.
Networks built into many integrated circuits provide some protection, but in many cases, the discharge
contains enough power to alter device parameters or melt silicon junctions.
Generating static
The following table shows how humidity aects the electrostatic voltage levels generated by dierent
activities. A product can be degraded by 700 volts.
●
Dierent activities generate dierent amounts of static electricity.
●
Static electricity increases as humidity decreases.
Relative Humidity
Event 55% 40% 10%
Walking across carpet
Walking across vinyl oor
Motions of bench worker
Removing DIPs from plastic tube
7,500 V
3,000 V
400 V
400 V
15,000 V
5,000 V
800 V
700 V
35,000 V
12,000 V
6,000 V
2,000 V
Removing DIPs from vinyl tray
Removing DIPs from Styrofoam
Removing bubble pack from PCB
Packing PCBs in foam-lined box
2,000 V
3,500 V
7,000 V
5,000 V
4,000 V
5,000 V
20,000 V
11,000 V
11,500 V
14,500 V
26,500 V
21,000 V
8 Chapter 3 Routine care, SATA drive guidelines, and disassembly preparation

HP 280 G3 Specifications

General

Memory slots	2x DIMM
Internal memory	8 GB
Memory clock speed	2666 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	32 GB
Tjunction	100 °C
Processor cache	9 MB
Processor cores	6
System bus rate	8 GT/s
Processor family	Intel® Core™ i5
Processor socket	LGA 1151 (Socket H4)
Processor frequency	3 GHz
Processor cache type	Smart Cache
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	4.4 GHz
Processor operating modes	64-bit
PCI Express configurations	1x8+2x4, 1x16, 2x8
Thermal Design Power (TDP)	65 W
Number of processors installed	1
Maximum number of PCI Express lanes	16
Memory bandwidth supported by processor (max)	41.6 GB/s
Maximum internal memory supported by processor	128 GB
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Total HDDs capacity	1000 GB
Card reader integrated	-
On-board graphics card	Yes
On-board graphics card ID	0x3E92
On-board graphics card model	Intel® UHD Graphics 630
Maximum on-board graphics card memory	64 GB
On-board graphics card OpenGL version	4.5
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1100 MHz
Number of displays supported (on-board graphics)	3
Microphone in	No
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	2
USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity	0
Chassis type	SFF
Product color	Black
Placement supported	Horizontal/Vertical
Product type	PC
Motherboard chipset	Intel® H370
HP segment	Business
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Power supply	180 W
Scalability	1S
Processor ARK ID	134895
Processor package size	37.5 x 37.5 mm
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Thermal solution specification	PCG 2015C

Weight and Dimensions

Depth	296 mm
Width	95 mm
Height	270 mm
Weight	4200 g