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HP 280 G3 User Manual

HP 280 G3
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Preventing electrostatic damage to equipment
Many electronic components are sensitive to ESD. Circuitry design and structure determine the degree of
sensitivity. The following packaging and grounding precautions are necessary to prevent damage to electric
components and accessories.
To avoid hand contact, transport products in static-safe containers such as tubes, bags, or boxes.
Protect all electrostatic-sensitive parts and assemblies with conductive or approved containers or
packaging.
Keep electrostatic-sensitive parts in their containers until they arrive at static-free stations.
Place items on a grounded surface before removing them from their containers.
Always be properly grounded when touching a sensitive component or assembly.
Avoid contact with pins, leads, or circuitry.
Place reusable electrostatic-sensitive parts from assemblies in protective packaging or conductive
foam.
Personal grounding methods and equipment
Use the following equipment to prevent static electricity damage to equipment:
Wrist straps are exible straps with a maximum of one-megohm ± 10% resistance in the ground cords.
To provide proper ground, a strap must be worn snugly against bare skin. The ground cord must be
connected to the banana plug connector on the grounding mat or workstation and t snugly into it.
Heel straps/Toe straps/Boot straps can be used at standing workstations and are compatible with
most types of shoes or boots. On conductive oors or dissipative oor mats, use them on both feet with
a maximum of one-megohm ± 10% resistance between the operator and ground.
Static Shielding Protection Levels
Method Voltage
Antistatic plastic
Carbon-loaded plastic
Metallized laminate
1,500
7,500
15,000
Grounding the work area
To prevent static damage at the work area, observe the following precautions:
Cover the work surface with approved static-dissipative material. Provide a wrist strap connected to the
work surface and use properly grounded tools and equipment.
Use static-dissipative mats, foot straps, or air ionizers to give added protection.
Handle electrostatic-sensitive components, parts, and assemblies by the case or PCB laminate. Handle
them only at static-free work areas.
Turn o power and input signals before inserting and removing connectors or test equipment.
Use xtures made of static-safe materials when xtures must directly contact dissipative surfaces.
Keep work area free of nonconductive materials such as ordinary plastic assembly aids and Styrofoam.
Use eld service tools, such as cutters, screwdrivers, and vacuums, that are conductive.
Electrostatic discharge information 9

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HP 280 G3 Specifications

General IconGeneral
Memory slots2x DIMM
Internal memory8 GB
Memory clock speed2666 MHz
Internal memory typeDDR4-SDRAM
Maximum internal memory32 GB
Tjunction100 °C
Processor cache9 MB
Processor cores6
System bus rate8 GT/s
Processor familyIntel® Core™ i5
Processor socketLGA 1151 (Socket H4)
Processor frequency3 GHz
Processor cache typeSmart Cache
Processor lithography14 nm
Processor manufacturerIntel
PCI Express slots version3.0
Processor boost frequency4.4 GHz
Processor operating modes64-bit
PCI Express configurations1x8+2x4, 1x16, 2x8
Thermal Design Power (TDP)65 W
Number of processors installed1
Maximum number of PCI Express lanes16
Memory bandwidth supported by processor (max)41.6 GB/s
Maximum internal memory supported by processor128 GB
HDD speed7200 RPM
HDD interfaceSATA
Storage mediaHDD
Total HDDs capacity1000 GB
Card reader integrated-
On-board graphics cardYes
On-board graphics card ID0x3E92
On-board graphics card modelIntel® UHD Graphics 630
Maximum on-board graphics card memory64 GB
On-board graphics card OpenGL version4.5
On-board graphics card base frequency350 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)1100 MHz
Number of displays supported (on-board graphics)3
Microphone inNo
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity2
USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity0
Chassis typeSFF
Product colorBlack
Placement supportedHorizontal/Vertical
Product typePC
Motherboard chipsetIntel® H370
HP segmentBusiness
Ethernet LAN data rates10, 100, 1000 Mbit/s
Power supply180 W
Scalability1S
Processor ARK ID134895
Processor package size37.5 x 37.5 mm
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Thermal solution specificationPCG 2015C
Weight and Dimensions IconWeight and Dimensions
Depth296 mm
Width95 mm
Height270 mm
Weight4200 g

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