HP 280 G3 User Manual

4 Removal and replacement procedures
Adherence to the procedures and precautions described in this chapter is essential for proper service. After
completing all necessary removal and replacement procedures, run the Diagnostics utility to verify that all
components operate properly.
NOTE: Not all features listed in this guide are available on all computers.
Preparation for disassembly
WARNING! Voltage is always present on the system board when the computer is plugged into an active AC
outlet. To avoid possible personal injury and damage to the equipment the power cord should be
disconnected from the computer and/or the AC outlet before opening the computer.
See Routine care, SATA drive guidelines, and disassembly preparation on page 8 for initial safety procedures.
1. Remove/disengage any security devices that prohibit opening the computer.
2. Remove all removable media, such as compact discs or USB ash drives, from the computer.
3. Turn o the computer properly through the operating system, then turn o any external devices.
4. Disconnect the power cord from the power outlet and disconnect any external devices.
CAUTION: Turn o the computer before disconnecting any cables.
Regardless of the power-on state, voltage is always present on the system board as long as the system
is plugged into an active AC outlet. In some systems the cooling fan is on even when the computer is in
the “Standby,” or “Suspend” modes. The power cord should always be disconnected before servicing a
unit.
NOTE: During disassembly, label each cable as you remove it, noting its position and routing. Keep all
screws with the removed components.
Preparation for disassembly 15

HP 280 G3 Specifications

General

Memory slots	2x DIMM
Internal memory	8 GB
Memory clock speed	2666 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	32 GB
Tjunction	100 °C
Processor cache	9 MB
Processor cores	6
System bus rate	8 GT/s
Processor family	Intel® Core™ i5
Processor socket	LGA 1151 (Socket H4)
Processor frequency	3 GHz
Processor cache type	Smart Cache
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	4.4 GHz
Processor operating modes	64-bit
PCI Express configurations	1x8+2x4, 1x16, 2x8
Thermal Design Power (TDP)	65 W
Number of processors installed	1
Maximum number of PCI Express lanes	16
Memory bandwidth supported by processor (max)	41.6 GB/s
Maximum internal memory supported by processor	128 GB
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Total HDDs capacity	1000 GB
Card reader integrated	-
On-board graphics card	Yes
On-board graphics card ID	0x3E92
On-board graphics card model	Intel® UHD Graphics 630
Maximum on-board graphics card memory	64 GB
On-board graphics card OpenGL version	4.5
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1100 MHz
Number of displays supported (on-board graphics)	3
Microphone in	No
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	2
USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity	0
Chassis type	SFF
Product color	Black
Placement supported	Horizontal/Vertical
Product type	PC
Motherboard chipset	Intel® H370
HP segment	Business
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Power supply	180 W
Scalability	1S
Processor ARK ID	134895
Processor package size	37.5 x 37.5 mm
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Thermal solution specification	PCG 2015C

Weight and Dimensions

Depth	296 mm
Width	95 mm
Height	270 mm
Weight	4200 g