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HP 280 G3 User Manual

HP 280 G3
116 pages
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Fan sink
CAUTION: The bond between the fan sink and the processor may be very tight.
If the computer will power on, before removing the fan sink, turn on the computer until it warms the fan sink.
Warming the fan sink lessens the bond between the heat sink and the processor, thereby making separating
them easier.
Make sure not to pull the processor out of the socket when you lift the fan sink, especially if you cannot warm
the fan sink prior to removal. Inadvertently removing the processor can damage the pins.
The fan sink is secured atop the processor with four captive Torx screws. The fan sink includes a heat sink and
a fan.
1. Prepare the computer for disassembly (Preparation for disassembly on page 15).
2. Remove the access panel (Access panel on page 16).
3. Remove the fan duct (Fan duct on page 32).
4. Disconnect the fan cable from the system board (1), and then loosen the four captive Torx T15 screws
(2) that secure the fan sink to the system board tray.
CAUTION: Remove fan sink retaining screws in diagonally opposite pairs (as in an X) to even the
downward forces on the processor. This is especially important as the pins on the socket are very fragile
and any damage to them may require replacing the system board.
5. Lift the heat sink from atop the processor (3).
To install the fan sink, reverse the removal procedure.
When reinstalling the fan sink, make sure that its bottom has been cleaned with an alcohol wipe and fresh
thermal grease has been applied to the top of the processor.
CAUTION: Fan sink retaining screws should be tightened in diagonally opposite pairs (as in an X) to evenly
seat the fan sink on the processor to avoid damage that could require replacing the system board.
Make sure to replace the fan duct. Failure to install the fan duct may cause the computer to overheat.
Fan sink 33

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HP 280 G3 Specifications

General IconGeneral
Memory slots2x DIMM
Internal memory8 GB
Memory clock speed2666 MHz
Internal memory typeDDR4-SDRAM
Maximum internal memory32 GB
Tjunction100 °C
Processor cache9 MB
Processor cores6
System bus rate8 GT/s
Processor familyIntel® Core™ i5
Processor socketLGA 1151 (Socket H4)
Processor frequency3 GHz
Processor cache typeSmart Cache
Processor lithography14 nm
Processor manufacturerIntel
PCI Express slots version3.0
Processor boost frequency4.4 GHz
Processor operating modes64-bit
PCI Express configurations1x8+2x4, 1x16, 2x8
Thermal Design Power (TDP)65 W
Number of processors installed1
Maximum number of PCI Express lanes16
Memory bandwidth supported by processor (max)41.6 GB/s
Maximum internal memory supported by processor128 GB
HDD speed7200 RPM
HDD interfaceSATA
Storage mediaHDD
Total HDDs capacity1000 GB
Card reader integrated-
On-board graphics cardYes
On-board graphics card ID0x3E92
On-board graphics card modelIntel® UHD Graphics 630
Maximum on-board graphics card memory64 GB
On-board graphics card OpenGL version4.5
On-board graphics card base frequency350 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)1100 MHz
Number of displays supported (on-board graphics)3
Microphone inNo
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity2
USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity0
Chassis typeSFF
Product colorBlack
Placement supportedHorizontal/Vertical
Product typePC
Motherboard chipsetIntel® H370
HP segmentBusiness
Ethernet LAN data rates10, 100, 1000 Mbit/s
Power supply180 W
Scalability1S
Processor ARK ID134895
Processor package size37.5 x 37.5 mm
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Thermal solution specificationPCG 2015C
Weight and Dimensions IconWeight and Dimensions
Depth296 mm
Width95 mm
Height270 mm
Weight4200 g

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