HP 280 G3 User Manual

Fan sink
CAUTION: The bond between the fan sink and the processor may be very tight.
If the computer will power on, before removing the fan sink, turn on the computer until it warms the fan sink.
Warming the fan sink lessens the bond between the heat sink and the processor, thereby making separating
them easier.
Make sure not to pull the processor out of the socket when you lift the fan sink, especially if you cannot warm
the fan sink prior to removal. Inadvertently removing the processor can damage the pins.
The fan sink is secured atop the processor with four captive Torx screws. The fan sink includes a heat sink and
a fan.
1. Prepare the computer for disassembly (Preparation for disassembly on page 15).
2. Remove the access panel (Access panel on page 16).
3. Remove the fan duct (Fan duct on page 32).
4. Disconnect the fan cable from the system board (1), and then loosen the four captive Torx T15 screws
(2) that secure the fan sink to the system board tray.
CAUTION: Remove fan sink retaining screws in diagonally opposite pairs (as in an X) to even the
downward forces on the processor. This is especially important as the pins on the socket are very fragile
and any damage to them may require replacing the system board.
5. Lift the heat sink from atop the processor (3).
To install the fan sink, reverse the removal procedure.
When reinstalling the fan sink, make sure that its bottom has been cleaned with an alcohol wipe and fresh
thermal grease has been applied to the top of the processor.
CAUTION: Fan sink retaining screws should be tightened in diagonally opposite pairs (as in an X) to evenly
seat the fan sink on the processor to avoid damage that could require replacing the system board.
Make sure to replace the fan duct. Failure to install the fan duct may cause the computer to overheat.
Fan sink 33

HP 280 G3 Specifications

General

Memory slots	2x DIMM
Internal memory	8 GB
Memory clock speed	2666 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	32 GB
Tjunction	100 °C
Processor cache	9 MB
Processor cores	6
System bus rate	8 GT/s
Processor family	Intel® Core™ i5
Processor socket	LGA 1151 (Socket H4)
Processor frequency	3 GHz
Processor cache type	Smart Cache
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	4.4 GHz
Processor operating modes	64-bit
PCI Express configurations	1x8+2x4, 1x16, 2x8
Thermal Design Power (TDP)	65 W
Number of processors installed	1
Maximum number of PCI Express lanes	16
Memory bandwidth supported by processor (max)	41.6 GB/s
Maximum internal memory supported by processor	128 GB
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Total HDDs capacity	1000 GB
Card reader integrated	-
On-board graphics card	Yes
On-board graphics card ID	0x3E92
On-board graphics card model	Intel® UHD Graphics 630
Maximum on-board graphics card memory	64 GB
On-board graphics card OpenGL version	4.5
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1100 MHz
Number of displays supported (on-board graphics)	3
Microphone in	No
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	2
USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity	0
Chassis type	SFF
Product color	Black
Placement supported	Horizontal/Vertical
Product type	PC
Motherboard chipset	Intel® H370
HP segment	Business
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Power supply	180 W
Scalability	1S
Processor ARK ID	134895
Processor package size	37.5 x 37.5 mm
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Thermal solution specification	PCG 2015C

Weight and Dimensions

Depth	296 mm
Width	95 mm
Height	270 mm
Weight	4200 g