HP 280 G3 User Manual

Solving memory problems
If you encounter memory problems, some common causes and solutions are listed in the following table.
CAUTION: Power may still be supplied to the DIMMs when the computer is turned o (depending on the
Management Engine (ME) settings). To avoid damage to the DIMMs or the system board, you must unplug the
computer power cord before attempting to reseat, install, or remove a memory module.
For those systems that support ECC memory, HP does not support mixing ECC and non-ECC memory.
Otherwise, the computer will not boot the operating system.
NOTE: The memory count will be aected by congurations with the Management Engine (ME) enabled. The
ME uses 8MB of system memory in single channel mode or 16MB of memory in dual-channel mode to
download, decompress, and execute the ME rmware for Out-of-Band (OOB), third-party data storage, and
other management functions.
System will not boot or does not function properly after installing additional memory modules.
Cause Solution
A memory module is not installed in the DIMM1 or XMM1 socket. Ensure that a memory module is installed in the DIMM1 or XMM1
socket on the system board. This socket must be populated with a
memory module.
Memory module is not the correct type or speed grade for the
system or the new memory module is not seated properly.
Replace module with the correct industry-standard device for the
computer. On some models, ECC and non-ECC memory modules
cannot be mixed.
Out of memory error.
Cause Solution
You have run out of memory to run the application. Check the application documentation to determine the memory
requirements.
Memory count during POST is wrong.
Cause Solution
The memory modules may not be installed correctly. Check that the memory modules have been installed correctly and
that proper modules are used.
Integrated graphics may use system memory. No action required.
Insucient memory error during operation.
Cause Solution
Too many Terminate and Stay Resident programs (TSRs) are
installed.
Delete any TSRs that you do not need.
You have run out of memory for the application. Check the memory requirements for the application or add more
memory to the computer.
Solving memory problems 71

HP 280 G3 Specifications

General

Memory slots	2x DIMM
Internal memory	8 GB
Memory clock speed	2666 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	32 GB
Tjunction	100 °C
Processor cache	9 MB
Processor cores	6
System bus rate	8 GT/s
Processor family	Intel® Core™ i5
Processor socket	LGA 1151 (Socket H4)
Processor frequency	3 GHz
Processor cache type	Smart Cache
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	4.4 GHz
Processor operating modes	64-bit
PCI Express configurations	1x8+2x4, 1x16, 2x8
Thermal Design Power (TDP)	65 W
Number of processors installed	1
Maximum number of PCI Express lanes	16
Memory bandwidth supported by processor (max)	41.6 GB/s
Maximum internal memory supported by processor	128 GB
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Total HDDs capacity	1000 GB
Card reader integrated	-
On-board graphics card	Yes
On-board graphics card ID	0x3E92
On-board graphics card model	Intel® UHD Graphics 630
Maximum on-board graphics card memory	64 GB
On-board graphics card OpenGL version	4.5
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1100 MHz
Number of displays supported (on-board graphics)	3
Microphone in	No
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	2
USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity	0
Chassis type	SFF
Product color	Black
Placement supported	Horizontal/Vertical
Product type	PC
Motherboard chipset	Intel® H370
HP segment	Business
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Power supply	180 W
Scalability	1S
Processor ARK ID	134895
Processor package size	37.5 x 37.5 mm
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Thermal solution specification	PCG 2015C

Weight and Dimensions

Depth	296 mm
Width	95 mm
Height	270 mm
Weight	4200 g