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HP 280 G3 User Manual

HP 280 G3
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Recommended materials and equipment
The following grounding equipment is recommended to prevent electrostatic damage:
Antistatic tape
Antistatic smocks, aprons, or sleeve protectors
Conductive bins and other assembly or soldering aids
Conductive foam
Conductive tabletop workstations with ground cords of one-megohm +/- 10% resistance
Static-dissipative table or oor mats with hard ties to ground
Field service kits
Static awareness labels
Wrist straps and footwear straps providing one-megohm +/- 10% resistance
Material handling packages
Conductive plastic bags
Conductive plastic tubes
Conductive tote boxes
Opaque shielding bags
Transparent metallized shielding bags
Transparent shielding tubes
Operating guidelines
To prevent overheating and to help prolong the life of the computer:
Keep the computer away from excessive moisture, direct sunlight, and extremes of heat and cold.
Operate the computer on a sturdy, level surface. Leave a 10.2 cm (4-inch) clearance on all vented sides
of the computer and above the monitor to permit the required airow.
Never restrict the airow into the computer by blocking any vents or air intakes. Do not place the
keyboard, with the keyboard feet down, directly against the front of the desktop unit as this also
restricts airow.
Occasionally clean the air vents on all vented sides of the computer. Lint, dust, and other foreign matter
can block the vents and limit the airow. Be sure to unplug the computer before cleaning the air vents.
Never operate the computer with the cover or side panel removed.
Do not stack computers on top of each other or place computers so near each other that they are subject
to each other’s re-circulated or preheated air.
If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must be
provided on the enclosure, and the same operating guidelines listed above will still apply.
Keep liquids away from the computer and keyboard.
10 Chapter 3 Routine care, SATA drive guidelines, and disassembly preparation

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HP 280 G3 Specifications

General IconGeneral
Memory slots2x DIMM
Internal memory8 GB
Memory clock speed2666 MHz
Internal memory typeDDR4-SDRAM
Maximum internal memory32 GB
Tjunction100 °C
Processor cache9 MB
Processor cores6
System bus rate8 GT/s
Processor familyIntel® Core™ i5
Processor socketLGA 1151 (Socket H4)
Processor frequency3 GHz
Processor cache typeSmart Cache
Processor lithography14 nm
Processor manufacturerIntel
PCI Express slots version3.0
Processor boost frequency4.4 GHz
Processor operating modes64-bit
PCI Express configurations1x8+2x4, 1x16, 2x8
Thermal Design Power (TDP)65 W
Number of processors installed1
Maximum number of PCI Express lanes16
Memory bandwidth supported by processor (max)41.6 GB/s
Maximum internal memory supported by processor128 GB
HDD speed7200 RPM
HDD interfaceSATA
Storage mediaHDD
Total HDDs capacity1000 GB
Card reader integrated-
On-board graphics cardYes
On-board graphics card ID0x3E92
On-board graphics card modelIntel® UHD Graphics 630
Maximum on-board graphics card memory64 GB
On-board graphics card OpenGL version4.5
On-board graphics card base frequency350 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)1100 MHz
Number of displays supported (on-board graphics)3
Microphone inNo
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity2
USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity0
Chassis typeSFF
Product colorBlack
Placement supportedHorizontal/Vertical
Product typePC
Motherboard chipsetIntel® H370
HP segmentBusiness
Ethernet LAN data rates10, 100, 1000 Mbit/s
Power supply180 W
Scalability1S
Processor ARK ID134895
Processor package size37.5 x 37.5 mm
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Thermal solution specificationPCG 2015C
Weight and Dimensions IconWeight and Dimensions
Depth296 mm
Width95 mm
Height270 mm
Weight4200 g

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