HP 280 G3 User Manual

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Never cover the ventilation slots on the monitor with any type of material.
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Install or enable power management functions of the operating system or other software, including
sleep states.
Routine care
General cleaning safety precautions
1. Never use solvents or ammable solutions to clean the computer.
2. Never immerse any parts in water or cleaning solutions; apply any liquids to a clean cloth and then use
the cloth on the component.
3. Always unplug the computer when cleaning with liquids or damp cloths.
4. Always unplug the computer before cleaning the keyboard, mouse, or air vents.
5. Disconnect the keyboard before cleaning it.
6. Wear safety glasses equipped with side shields when cleaning the keyboard.
Cleaning the computer case
Follow all safety precautions in General cleaning safety precautions on page 11 before cleaning the computer.
To clean the computer case, follow the procedures described below:
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To remove light stains or dirt, use plain water with a clean, lint-free cloth or swab.
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For stronger stains, use a mild dishwashing liquid diluted with water. Rinse well by wiping the surface
with a cloth or swab dampened with clear water.
●
For stubborn stains, use isopropyl (rubbing) alcohol. No rinsing is needed; alcohol will evaporate quickly
without leaving a residue.
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After cleaning, always wipe the unit with a clean, lint-free cloth.
●
Occasionally clean the air vents on the computer. Lint and other foreign matter can block the vents and
limit the airow.
Cleaning the keyboard
Follow all safety precautions in General cleaning safety precautions on page 11 before cleaning the keyboard.
To clean the tops of the keys or the keyboard body, follow the procedures described in Cleaning the computer
case on page 11.
When cleaning debris from under the keys, review all rules in General cleaning safety precautions on page 11
before following these procedures:
CAUTION: Use safety glasses equipped with side shields before attempting to clean debris from under the
keys.
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Visible debris underneath or between the keys may be removed by vacuuming or shaking.
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Canned, pressurized air may be used to clean debris from under the keys. Caution should be used as too
much air pressure can dislodge lubricants applied under the wide keys.
Routine care 11

HP 280 G3 Specifications

General

Memory slots	2x DIMM
Internal memory	8 GB
Memory clock speed	2666 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	32 GB
Tjunction	100 °C
Processor cache	9 MB
Processor cores	6
System bus rate	8 GT/s
Processor family	Intel® Core™ i5
Processor socket	LGA 1151 (Socket H4)
Processor frequency	3 GHz
Processor cache type	Smart Cache
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	4.4 GHz
Processor operating modes	64-bit
PCI Express configurations	1x8+2x4, 1x16, 2x8
Thermal Design Power (TDP)	65 W
Number of processors installed	1
Maximum number of PCI Express lanes	16
Memory bandwidth supported by processor (max)	41.6 GB/s
Maximum internal memory supported by processor	128 GB
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Total HDDs capacity	1000 GB
Card reader integrated	-
On-board graphics card	Yes
On-board graphics card ID	0x3E92
On-board graphics card model	Intel® UHD Graphics 630
Maximum on-board graphics card memory	64 GB
On-board graphics card OpenGL version	4.5
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1100 MHz
Number of displays supported (on-board graphics)	3
Microphone in	No
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	2
USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity	0
Chassis type	SFF
Product color	Black
Placement supported	Horizontal/Vertical
Product type	PC
Motherboard chipset	Intel® H370
HP segment	Business
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Power supply	180 W
Scalability	1S
Processor ARK ID	134895
Processor package size	37.5 x 37.5 mm
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Thermal solution specification	PCG 2015C

Weight and Dimensions

Depth	296 mm
Width	95 mm
Height	270 mm
Weight	4200 g