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HP 280 G3 User Manual

HP 280 G3
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If you want to remove a key, use a specially designed key puller to prevent damage to the keys. This tool
is available through many electronics supply outlets.
CAUTION: Never remove a wide, level key (like the space bar) from the keyboard. If these keys are
improperly removed or installed, the keyboard may not function properly.
Cleaning under a key may be done with a swab moistened with isopropyl alcohol and then squeezed out.
Be careful not to wipe away lubricants necessary for proper key functions. Use tweezers to remove any
bers or dirt in conned areas. Allow the parts to air dry before reassembly.
Cleaning the monitor
Wipe the monitor screen with a towelette designed for cleaning monitors or with a clean cloth
moistened with water. Do not use sprays or aerosols directly on the screen; the liquid may seep into the
housing and damage a component. Never use solvents or ammable liquids on the monitor.
To clean the monitor body follow the procedures in Cleaning the computer case on page 11.
Cleaning the mouse
Before cleaning the mouse, ensure that the power to the computer is turned o.
Clean the mouse ball by rst removing the retaining plate and the ball from the housing. Pull out any
debris from the ball socket and wipe the ball with a clean, dry cloth before reassembly.
To clean the mouse body, follow the procedures in Cleaning the computer case on page 11.
Service considerations
Listed below are some of the considerations that you should keep in mind during the disassembly and
assembly of the computer.
Tools and software requirements
To service the computer, you need the following:
Torx T-15 screwdriver
Flat-bladed screwdriver (may sometimes be used in place of the Torx screwdriver)
Phillips #2 screwdriver
Diagnostics software
Screws
The screws used in the computer are not interchangeable. They may have standard or metric threads and may
be of dierent lengths. If an incorrect screw is used during the reassembly process, it can damage the unit. HP
strongly recommends that all screws removed during disassembly be kept with the part that was removed,
then returned to their proper locations.
CAUTION: Metric screws have a black nish. U.S. screws have a silver nish and are used on hard drives only.
CAUTION: As each subassembly is removed from the computer, it should be placed away from the work area
to prevent damage.
12 Chapter 3 Routine care, SATA drive guidelines, and disassembly preparation

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HP 280 G3 Specifications

General IconGeneral
Memory slots2x DIMM
Internal memory8 GB
Memory clock speed2666 MHz
Internal memory typeDDR4-SDRAM
Maximum internal memory32 GB
Tjunction100 °C
Processor cache9 MB
Processor cores6
System bus rate8 GT/s
Processor familyIntel® Core™ i5
Processor socketLGA 1151 (Socket H4)
Processor frequency3 GHz
Processor cache typeSmart Cache
Processor lithography14 nm
Processor manufacturerIntel
PCI Express slots version3.0
Processor boost frequency4.4 GHz
Processor operating modes64-bit
PCI Express configurations1x8+2x4, 1x16, 2x8
Thermal Design Power (TDP)65 W
Number of processors installed1
Maximum number of PCI Express lanes16
Memory bandwidth supported by processor (max)41.6 GB/s
Maximum internal memory supported by processor128 GB
HDD speed7200 RPM
HDD interfaceSATA
Storage mediaHDD
Total HDDs capacity1000 GB
Card reader integrated-
On-board graphics cardYes
On-board graphics card ID0x3E92
On-board graphics card modelIntel® UHD Graphics 630
Maximum on-board graphics card memory64 GB
On-board graphics card OpenGL version4.5
On-board graphics card base frequency350 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)1100 MHz
Number of displays supported (on-board graphics)3
Microphone inNo
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity2
USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity0
Chassis typeSFF
Product colorBlack
Placement supportedHorizontal/Vertical
Product typePC
Motherboard chipsetIntel® H370
HP segmentBusiness
Ethernet LAN data rates10, 100, 1000 Mbit/s
Power supply180 W
Scalability1S
Processor ARK ID134895
Processor package size37.5 x 37.5 mm
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Thermal solution specificationPCG 2015C
Weight and Dimensions IconWeight and Dimensions
Depth296 mm
Width95 mm
Height270 mm
Weight4200 g

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