HP 280 G3 User Manual

Memory
Description
16-GB
8-GB
4-GB
The computer comes with double data rate 4 synchronous dynamic random access memory (DDR4-SDRAM)
dual inline memory modules (DIMMs).
DIMMs
The memory sockets on the system board can be populated with up to two industry-standard DIMMs. These
memory sockets are populated with at least one preinstalled DIMM. To achieve the maximum memory
support, you can populate the system board with up to 32-GB of memory congured in a high-performing
dual channel mode.
DDR4-SDRAM DIMMs
For proper system operation, the DIMMs must be:
●
industry-standard 288-pin
●
unbuered non-ECC PC4-21300 DDR4-2666 MHz-compliant
●
1.2 volt DDR4-SDRAM DIMMs
The DIMMs must also:
●
support CAS latency 16 DDR4 2666 MHz (16-16-16 timing)
●
contain the mandatory JEDEC SPD information
In addition, the computer supports:
●
512-Mbit, 1-Gbit, and 2-Gbit non-ECC memory technologies
●
single-sided and double-sided DIMMs
●
DIMMs constructed with x8 and x16 DDR devices; DIMMs constructed with x4 SDRAM are not supported
NOTE: The system will not operate properly if you install unsupported DIMMs.
Populating DIMM sockets
There are two DIMM sockets on the system board, with one socket per channel. The sockets are labeled
DIMM1 and DIMM3. Socket DIMM1 operates in memory channel B. Socket DIMM3 operates in memory channel
A.
The system will automatically operate in single channel mode, dual channel mode, or ex mode, depending
on how the DIMMs are installed.
NOTE: Single channel and unbalanced dual channel memory congurations will result in inferior graphics
performance.
28 Chapter 4 Removal and replacement procedures

HP 280 G3 Specifications

General

Memory slots	2x DIMM
Internal memory	8 GB
Memory clock speed	2666 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	32 GB
Tjunction	100 °C
Processor cache	9 MB
Processor cores	6
System bus rate	8 GT/s
Processor family	Intel® Core™ i5
Processor socket	LGA 1151 (Socket H4)
Processor frequency	3 GHz
Processor cache type	Smart Cache
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	4.4 GHz
Processor operating modes	64-bit
PCI Express configurations	1x8+2x4, 1x16, 2x8
Thermal Design Power (TDP)	65 W
Number of processors installed	1
Maximum number of PCI Express lanes	16
Memory bandwidth supported by processor (max)	41.6 GB/s
Maximum internal memory supported by processor	128 GB
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Total HDDs capacity	1000 GB
Card reader integrated	-
On-board graphics card	Yes
On-board graphics card ID	0x3E92
On-board graphics card model	Intel® UHD Graphics 630
Maximum on-board graphics card memory	64 GB
On-board graphics card OpenGL version	4.5
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1100 MHz
Number of displays supported (on-board graphics)	3
Microphone in	No
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	2
USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity	0
Chassis type	SFF
Product color	Black
Placement supported	Horizontal/Vertical
Product type	PC
Motherboard chipset	Intel® H370
HP segment	Business
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Power supply	180 W
Scalability	1S
Processor ARK ID	134895
Processor package size	37.5 x 37.5 mm
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Thermal solution specification	PCG 2015C

Weight and Dimensions

Depth	296 mm
Width	95 mm
Height	270 mm
Weight	4200 g