HP 280 G3 User Manual

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The system will operate in single channel mode if the DIMM sockets are populated in one channel only.
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The system will operate in a higher-performing dual channel mode if the memory capacity of the DIMM
in Channel A is equal to the memory capacity of the DIMM in Channel B.
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The system will operate in ex mode if the memory capacity of the DIMM in Channel A is not equal to the
memory capacity of the DIMM in Channel B. In ex mode, the channel populated with the least amount
of memory describes the total amount of memory assigned to dual channel and the remainder is
assigned to single channel. If one channel will have more memory than the other, the larger amount
should be assigned to Channel A.
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In any mode, the maximum operational speed is determined by the slowest DIMM in the system.
Removing and installing DIMMs
CAUTION: You must disconnect the power cord and wait approximately 30 seconds for the power to drain
before adding or removing memory modules. Regardless of the power-on state, voltage is always supplied to
the memory modules as long as the computer is plugged into an active AC outlet. Adding or removing
memory modules while voltage is present may cause irreparable damage to the memory modules or system
board.
The memory module sockets have gold-plated metal contacts. When upgrading the memory, it is important
to use memory modules with gold-plated metal contacts to prevent corrosion and/or oxidation resulting from
having incompatible metals in contact with each other.
Static electricity can damage the electronic components of the computer or optional cards. Before beginning
these procedures, ensure that you are discharged of static electricity by
briey touching a grounded metal
object.
When handling a memory module, be careful not to touch any of the contacts. Doing so may damage the
module.
1. Prepare the computer for disassembly (Preparation for disassembly on page 15).
2. Remove the access panel (Access panel on page 16).
3. Remove the front bezel (Front bezel on page 21).
4. Remove the optical drive (Optical drive on page 23).
5. Remove the drive cage (Hard drive on page 25).
6. To remove a memory module, open both latches of the memory module socket (1), and then remove the
memory module from the socket (2).
7. To install a memory module, open both latches of the memory module socket (1), and insert the
memory module into the socket (2).
Memory 29

HP 280 G3 Specifications

General

Memory slots	2x DIMM
Internal memory	8 GB
Memory clock speed	2666 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	32 GB
Tjunction	100 °C
Processor cache	9 MB
Processor cores	6
System bus rate	8 GT/s
Processor family	Intel® Core™ i5
Processor socket	LGA 1151 (Socket H4)
Processor frequency	3 GHz
Processor cache type	Smart Cache
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	4.4 GHz
Processor operating modes	64-bit
PCI Express configurations	1x8+2x4, 1x16, 2x8
Thermal Design Power (TDP)	65 W
Number of processors installed	1
Maximum number of PCI Express lanes	16
Memory bandwidth supported by processor (max)	41.6 GB/s
Maximum internal memory supported by processor	128 GB
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Total HDDs capacity	1000 GB
Card reader integrated	-
On-board graphics card	Yes
On-board graphics card ID	0x3E92
On-board graphics card model	Intel® UHD Graphics 630
Maximum on-board graphics card memory	64 GB
On-board graphics card OpenGL version	4.5
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1100 MHz
Number of displays supported (on-board graphics)	3
Microphone in	No
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	2
USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity	0
Chassis type	SFF
Product color	Black
Placement supported	Horizontal/Vertical
Product type	PC
Motherboard chipset	Intel® H370
HP segment	Business
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Power supply	180 W
Scalability	1S
Processor ARK ID	134895
Processor package size	37.5 x 37.5 mm
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Thermal solution specification	PCG 2015C

Weight and Dimensions

Depth	296 mm
Width	95 mm
Height	270 mm
Weight	4200 g