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General| Brand | Microchip Technology |
|---|---|
| Model | SAM Series |
| Category | Microcontrollers |
| Language | English |
Steps to submit user issues for technical support and guidance.
Link to Microchip's client support portal for assistance and resources.
Link to Microchip's technical support forum for help and community interaction.
Addresses general functional issues and errata review for MCUs.
Covers issues related to MCU power-up, clocking, and voltage ramp rates.
Details causes and solutions for device resets, lock-ups, and exception events.
Discusses problems encountered during debugging with ICD4/REAL_ICE, JTAG, and SWD.
Covers proper PCB layout and connection strategies for MCU pins and interfaces.
Addresses issues with data integrity and communication errors across interfaces.
Troubleshooting analog-to-digital converter performance and accuracy.
Design considerations for I2S interfaces and push button protection.
Guidance on protecting I2C interfaces from electrical issues and ensuring compatibility.
Methods for protecting power input circuits from surges and noise.
Design guidelines and troubleshooting for Ethernet interfaces and magnetics.
Comprehensive recommendations for PCB design, layout, and signal integrity.
Discusses issues with power supply voltage ramp rate during startup and its impact.
Proper use of bypass capacitors for stable power supply during peak current demands.
Critical voltage sequencing requirements for MCU startup and inter-supply compatibility.
Addresses issues from current injection via I/O pins during startup and power sequencing.
Troubleshooting crystal oscillator startup issues and AGC function.
Specific startup issues for PIC32MZxxEFxx devices using crystals.
Startup issues for PIC32MK/MZ/C families using external clocks.
Auto Gain Control issues and intermittent startup in SAM product families.
Proper selection and use of crystal load capacitors for oscillator circuit design.
Issues with hardware/software clock switching in PIC32MX/MM/MZ/MK families.
Clock switching issues in PIC32MX/MM/MZ/MK devices related to IESO and FCKSM.
Resets on wake from sleep or during clock switch in PIC32MX/MM devices.
Lock-ups due to power anomalies or cycling in PIC32MZ/MK/C devices.
Lock-ups due to undefined exception handlers or unhandled errors.
Impact of ESD, EMI, and EFT events on MCU operation and system stability.
Troubleshooting issues with ICD4/REAL_ICE for ICSP debugging and connections.
Debugging with JTAG and SWD interfaces, including wiring and pinouts.
Proper soldering and grounding of the MCU exposed pad for PCB design.
Issues with VUSB3V3 pin and USB interface signals in PIC32MX/MM/MZ/MK.
Troubleshooting MPLAB connection issues with MCLR/RESETN circuit.
Bypass capacitor usage for VBAT and ADC measurement accuracy.
Importance of impedance matching for signal integrity and preventing data corruption.
Key layout rules for high-speed signals, including differential pairs and ground planes.
Slew rate control for improving signal integrity and data transceiver errors.
Causes and solutions for data corruption due to ground loops between systems.
Troubleshooting SPI/SQI communication, data shifts, and corruption issues.
Protection design points for SPI SD card interfaces against ESD.
Issues and protection for SD Host Controller, including card access and write protect.
Protection design points for SDHC interfaces, focusing on ESD and signal routing.
Issues with UART data corruption, clock accuracy, and startup behavior.
Protection design points for UART interfaces, including RS232 connector.
Troubleshooting USB data transfer, enumeration, and connection loss issues.
Key design points for USB host interfaces, including shield grounding.
Key design points for USB device interfaces, including shield grounding.
Issues with CAN FD message errors, connectivity, and configuration requirements.
Configuration requirements for CAN FD data rates and silicon features.
Hardware requirements for CAN FD networks, including termination and cabling.
Protection design points for CAN FD/LIN interfaces.
Common error sources in SAM SAR ADCs, including offset, gain, and quantization.
Impact of noise on ADC performance, especially in mixed-signal pins.
Factors affecting ADC VREF accuracy and resulting measurement errors.
How circuit IR drops affect ADC measurements and accuracy.
Design points for I2S and push button protection, including ESD and filtering.
Key design points for I2C interface protection and level shifting.
Design guidelines for Ethernet interfaces, including differential pairs.
Termination of unused Ethernet cable pairs on the RJ45 connector.
Recommendations for Ethernet RJ45 connectors, including shield and ESD.
Factors to consider when selecting Ethernet magnetics for optimal performance.
Key protection points for Ethernet PHY interfaces, including ferrites and grounding.
Proper placement and use of bypass capacitors on PCBs for noise reduction.
Recommended PCB layer stack-up strategies for high-speed designs.
Ensuring signal integrity with proper terminations and layout for high-speed signals.
Guidelines for PCB trace routing, impedance matching, and crosstalk avoidance.
Information on accessing Microchip's website for support and resources.
Service for receiving updates and notifications on Microchip products.
Channels for receiving customer support from Microchip via various methods.
Details on Microchip's code protection feature and its limitations.
Legal disclaimers, warranties, and terms of use for the document.
List of Microchip and third-party trademarks mentioned in the document.
Information on Microchip's quality management systems and certifications.
Contact information for Microchip sales and service offices globally.
