Microhard Systems P900 - SMT Temperature Profile; Baking Instructions (MSL)

© Microhard Systems Inc. Confidential 16
2.0 Hardware Description
2.1.4 SMT Temperature Profile
Drawing 2-4: Reflow Profile
2.1.5 SMT Baking Instructions (MSL)
The P900 OEM modules must be baked before mounting, the following baking instruction should be fol-
lowed for the best results:
a) Minimum of 8 to 12 hours at 125°C +/- 5°C for high-temperature device containers.
b) Unused modules should be stored at ≤ 10% RH
0.0
60.0
120.0
180.0
240
300
165
217
60~100s
120s
T
MAX
=255
o
C
2.42(
o
C/s)
Temperature Zone Time Parameter
Preheat zone:
(40
o
C - 165
o
C)
- Heating rate:
0.5
o
C/s-2
o
C/s
Soak Zone:
(165
o
C - 217
o
C)
60 - 100s -
Reflow zone:
(>217
o
C)
120s Peak reflow:
255
o
C
Cooling zone Cooling rate: 2
o
C/s ≤ Slope ≤ 5
o
C/s
Table 2-1: Reflow Parameters
Zone Temperature (
o
C)
1 120
2 140
3 160
4 180
5 215
6 255
7 255
8 255
9 250
10 130
Chain Speed: 60cm/min
Table 2-2: Oven Temperature Profile