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ME12058B
Maintenance Section
3.3 Functions
Units Functions
Load port
FOUP
2 load ports for 300 mm or 200 mm wafers
Set the adapter into the FOUP for 200 mm wafers
Carrier ID reader
Slot mapping function
EFEM
Sample transport robot
Notch aligner
Open cassette for 300 mm or 200 mm wafers; selectable
by software
Main module
Sample stage Support the wafer for measurement horizontally
Measurement position: r-axis (0 to 150 mm), φ-axis (0 to
360 degrees)
Surface height: Z-axis (-13 mm to +1 mm)
Goniometer Type: θ-θ drive, θ
d
-axis (0 to 60 degrees), θ
s
-axis (0 to
60 degrees)
2θ/ω scan: 0 to 120 degrees
Rocking scan: maximum 0 to 60 degrees
Scanning can be performed along each axis separately
XRF incident-angle control: up to 0 to 15 degrees (up to
40 degrees if the distance between the SDD and the
sample is aligned)
X-ray source
For XRR, XRD, XRF
Cu target sealed tube 25 W
1 corner CMF mirror
Automatic single slit
X-ray counter (APD)
For XRR
Counting linearity: Up to the order of 10
8
cps
Automatic double slits
X-ray counter (SC70)
For XRD
Counting linearity: Up to the order of 10
5
cps
Automatic double slits
X-ray source
For XRF1
Mo target sealed tube 25 W
4-corner CMF mirror
X-ray source
For XRF2
Mo target sealed tube 25 W
4-corner CMF mirror
Fluorescent X-ray
counter (SDD)
For XRF
Silicon Drift Detector (Peltier cooling)
Hi-speed counting circuit, MCA: max. 10
5
cps
Mechanism for moving between measurement points
Pattern Navigation CCD camera system for wafer pattern recognition
Auto focus Auto focus system for wafer height alignment
Gate The door separating the goniometer from the EFEM
(Water Chiller) (Should be prepared separately)
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