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STM32F038x6 Package information
98
7.6 Thermal characteristics
The maximum chip junction temperature (T
J
max) must never exceed the values given in
Table 18: General operating conditions.
The maximum chip-junction temperature, T
J
max, in degrees Celsius, may be calculated
using the following equation:
T
J
max = T
A
max + (P
D
max x Θ
JA
)
Where:
• T
A
max is the maximum ambient temperature in °C,
•Θ
JA
is the package junction-to-ambient thermal resistance, in ° C/W,
• P
D
max is the sum of P
INT
max and P
I/O
max (P
D
max = P
INT
max + P
I/O
max),
• P
INT
max is the product of I
DD
and
V
DD
, expressed in Watts. This is the maximum chip
internal power.
P
I/O
max represents the maximum power dissipation on output pins where:
P
I/O
max = Σ (V
OL
× I
OL
) + Σ ((V
DDIOx
– V
OH
) × I
OH
),
taking into account the actual V
OL
/ I
OL
and V
OH
/ I
OH
of the I/Os at low and high level in the
application.
7.6.1 Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
Table 66. Package thermal characteristics
Symbol Parameter Value Unit
Θ
JA
Thermal resistance junction-ambient
LQFP48 - 7 × 7 mm
55
°C/W
Thermal resistance junction-ambient
UFQFPN32 - 5 × 5 mm
38
Thermal resistance junction-ambient
UFQFPN28 - 4 × 4 mm
118
Thermal resistance junction-ambient
WLCSP25 - 2.13 x 2.07 mm
74
Thermal resistance junction-ambient
TSSOP20 - 6.5 x 4.4 mm
110
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