STMicroelectronics STM32F038C6 - WLCSP25 Package Information; Table 63. WLCSP25 Package Mechanical Data; Figure 39. WLCSP25 Package Outline

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STM32F038x6 Package information
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7.4 WLCSP25 package information
WLCSP25 is a 25-ball, 2.423 x 2.325 mm, 0.4 mm pitch wafer level chip scale package.
Figure 39. WLCSP25 package outline
1. Drawing is not to scale.
Table 63. WLCSP25 package mechanical data
Symbol
millimeters inches
(1)
Min Typ Max Min Typ Max
A 0.525 0.555 0.585 0.0207 0.0219 0.0230
A1 - 0.175 - - 0.0069 -
A2 - 0.380 - - 0.0150 -
A3
(2)
- 0.025 - - 0.0010 -
b
(3) (4)
0.220 0.250 0.280 0.0087 0.0098 0.0110
D 2.388 2.423 2.458 0.0940 0.0954 0.0968
E 2.29 2.325 2.36 0.0902 0.0915 0.0929
e - 0.400 - - 0.0157 -
e1 - 1.600 - - 0.0630 -
e2 - 1.600 - - 0.0630 -
F - 0.4115 - - 0.0162 -
G - 0.3625 - - 0.0143 -
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