STMicroelectronics STM32F038C6 User Manual

DocID026079 Rev 3 89/102
STM32F038x6 Package information
98
7.4 WLCSP25 package information
WLCSP25 is a 25-ball, 2.423 x 2.325 mm, 0.4 mm pitch wafer level chip scale package.
Figure 39. WLCSP25 package outline
1. Drawing is not to scale.
Table 63. WLCSP25 package mechanical data
Symbol
millimeters inches
(1)
Min Typ Max Min Typ Max
A 0.525 0.555 0.585 0.0207 0.0219 0.0230
A1 - 0.175 - - 0.0069 -
A2 - 0.380 - - 0.0150 -
A3
(2)
- 0.025 - - 0.0010 -
b
(3) (4)
0.220 0.250 0.280 0.0087 0.0098 0.0110
D 2.388 2.423 2.458 0.0940 0.0954 0.0968
E 2.29 2.325 2.36 0.0902 0.0915 0.0929
e - 0.400 - - 0.0157 -
e1 - 1.600 - - 0.0630 -
e2 - 1.600 - - 0.0630 -
F - 0.4115 - - 0.0162 -
G - 0.3625 - - 0.0143 -
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STMicroelectronics STM32F038C6 Specifications

General

Brand	STMicroelectronics
Model	STM32F038C6
Category	Microcontrollers
Language	English