STMicroelectronics STM32F038C6 User Manual

DocID026079 Rev 3 83/102
STM32F038x6 Package information
98
Figure 33. UFQFPN32 package outline
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device
ground and must be connected. It is referred to as pin 0 in Table: Pin definitions.
!"?-%?6


3,1,GHQWLILHU
6($7,1*
3/$1(
&
&
GGG
$
$
$
H
E
'
E
(
/
H
(
(
'
/
'

STMicroelectronics STM32F038C6 Specifications

General

Brand	STMicroelectronics
Model	STM32F038C6
Category	Microcontrollers
Language	English