DocID026079 Rev 3 93/102
STM32F038x6 Package information
98
Figure 43. Recommended footprint for TSSOP20 package
1. Dimensions are expressed in millimeters.
k 0° - 8° 0° - 8°
aaa - - 0.100 - - 0.0039
1. Values in inches are converted from mm and rounded to four decimal digits.
2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs
shall not exceed 0.15mm per side.
3. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not
exceed 0.25mm per side.
Table 65. TSSOP20 package mechanical data (continued)
Symbol
millimeters inches
(1)
Min. Typ. Max. Min. Typ. Max.
9!?&0?6
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