Compaq Evo D500 - List of Figures

Technical Reference Guide
LIST OF FIGURES
F
IGURE
2–1. C
OMPAQ
D
ESKPRO
P
ERSONAL
C
OMPUTERS WITH
M
ONITORS
............................................... 2-1
F
IGURE
2–2. C
OMPAQ
D
ESKPROS
, F
RONT
V
IEWS
...................................................................................... 2-5
F
IGURE
2–3. C
OMPAQ
D
ESKPROS
, R
EAR
V
IEWS
........................................................................................ 2-6
F
IGURE
2–4. S
MALL
F
ORM
F
ACTOR
C
HASSIS
L
AYOUT
, T
OP
V
IEW
............................................................ 2-7
F
IGURE
2–5. S
LIM
D
ESKTOP
C
HASSIS
L
AYOUT
, T
OP
V
IEW
........................................................................ 2-8
F
IGURE
2–6. C
ONFIGURABLE
M
INITOWER
C
HASSIS
L
AYOUT
, L
EFT
S
IDE
V
IEW
(M
INITOWER
CONFIGURATION).................................................................................................................................. 2-9
F
IGURE
2–7. S
MALL
F
ORM
F
ACTOR
B
OARD
L
AYOUTS
............................................................................ 2-10
F
IGURE
2–8. S
LIM
D
ESKTOP OR
C
ONFIGURABLE
M
INITOWER
S
YSTEM
B
OARD
L
AYOUT
........................ 2-11
F
IGURE
2–9. C
OMPAQ
D
ESKPRO
A
RCHITECTURE
, B
LOCK DIAGRAM
......................................................... 2-13
F
IGURE
2–10. P
ROCESSOR
A
SSEMBLY
A
ND
M
OUNTING
.......................................................................... 2-14
F
IGURE
3–1. P
ROCESSOR
/M
EMORY
S
UBSYSTEM
A
RCHITECTURE
.............................................................. 3-1
F
IGURE
3–2. C
ELERON
P
ROCESSOR
I
NTERNAL
A
RCHITECTURE
................................................................. 3-2
F
IGURE
3–3. P
ENTIUM
III P
ROCESSOR
I
NTERNAL
A
RCHITECTURE
............................................................. 3-3
F
IGURE
3–4. S
YSTEM
M
EMORY
M
AP
......................................................................................................... 3-7
F
IGURE
4-1. PCI B
US
D
EVICES AND
F
UNCTIONS
......................................................................................... 4-2
F
IGURE
4-2. C
ONFIGURATION
C
YCLE
......................................................................................................... 4-4
F
IGURE
4-3. PCI C
ONFIGURATION
S
PACE
M
APPING
.................................................................................. 4-5
F
IGURE
4-4. PCI B
US
C
ONNECTOR
(32-B
IT
T
YPE
)..................................................................................... 4-9
F
IGURE
4-5. AGP 1X D
ATA
T
RANSFER
(P
EAK
T
RANSFER
R
ATE
: 266 MB/
S
).......................................... 4-11
F
IGURE
4-6. AGP 2X D
ATA
T
RANSFER
(P
EAK
T
RANSFER
R
ATE
: 532 MB/
S
).......................................... 4-12
F
IGURE
4-7. AGP 4X D
ATA
T
RANSFER
(P
EAK
T
RANSFER
R
ATE
: 1064 MB/
S
)........................................ 4-12
F
IGURE
4-8. U
NIVERSAL
AGP B
US
C
ONNECTOR
..................................................................................... 4-14
F
IGURE
4-9. M
ASKABLE
I
NTERRUPT
P
ROCESSING
, B
LOCK
D
IAGRAM
...................................................... 4-15
F
IGURE
4-10. C
ONFIGURATION
M
EMORY
M
AP
........................................................................................ 4-23
F
IGURE
4-11. S
MALL
F
ORM
F
ACTOR
F
AN
C
ONTROL
B
LOCK
D
IAGRAM
.................................................... 4-37
F
IGURE
4-12. S
LIM
D
ESKTOP
/C
ONFIGURABLE
M
INITOWER
F
AN
C
ONTROL
B
LOCK
D
IAGRAM
.................. 4-37
F
IGURE
5-1. 40-P
IN
P
RIMARY
IDE C
ONNECTOR
(
ON SYSTEM BOARD
)....................................................... 5-3
F
IGURE
5-2. 34-P
IN
D
ISKETTE
D
RIVE
C
ONNECTOR
.................................................................................... 5-7
F
IGURE
5-3. S
ERIAL
I
NTERFACE
C
ONNECTOR
(M
ALE
DB-9
AS VIEWED FROM REAR OF CHASSIS
) ............. 5-8
F
IGURE
5-4. COM1 S
ERIAL
I
NTERFACE
H
EADER
(S
MALL
F
ORM
F
ACTOR SYSTEM BOARD ONLY
) ............. 5-9
F
IGURE
5-5. P
ARALLEL
I
NTERFACE
C
ONNECTOR
(F
EMALE
DB-25
AS VIEWED FROM REAR OF CHASSIS
). 5-15
F
IGURE
5-6. 8042-T
O
-K
EYBOARD
T
RANSMISSION OF
C
ODE
ED
H
, T
IMING
D
IAGRAM
............................. 5-16
F
IGURE
5-7. K
EYBOARD OR
P
OINTING
D
EVICE
I
NTERFACE
C
ONNECTOR
................................................. 5-21
F
IGURE
5-8. USB I/F, B
LOCK
D
IAGRAM
.................................................................................................. 5-22
F
IGURE
5-9. USB P
ACKET
F
ORMATS
....................................................................................................... 5-23
F
IGURE
5-10. U
NIVERSAL
S
ERIAL
B
US
C
ONNECTOR
................................................................................ 5-25
F
IGURE
5-11. A
UDIO
S
UBSYSTEM
F
UNCTIONAL
B
LOCK
D
IAGRAM
.......................................................... 5-27
F
IGURE
5-12. AC’97 L
INK
B
US
P
ROTOCOL
............................................................................................. 5-28
F
IGURE
5-13. AD1881 A
UDIO
C
ODEC
F
UNCTIONAL
B
LOCK
D
IAGRAM
................................................... 5-29
F
IGURE
5-14. N
ETWORK
I
NTERFACE
C
ONTROLLER
B
LOCK
D
IAGRAM
..................................................... 5-32
F
IGURE
5-15. E
THERNET
TPE C
ONNECTOR
(RJ-45,
VIEWED FROM CARD EDGE
) ..................................... 5-36
F
IGURE
5-16. R
EMOTE
S
YSTEM
A
LERT
I
MPLEMENTATION
(G
ENERIC
R
EPRESENTATION
) ........................ 5-37
F
IGURE
5-17. RSA L
OGIC
, B
LOCK
D
IAGRAM
.......................................................................................... 5-37
F
IGURE
6-1. 815E-B
ASED
G
RAPHICS
, B
LOCK DIAGRAM
............................................................................ 6-2
F
IGURE
6-2. 82815 GMCH I
NTEGRATED
G
RAPHICS
S
UBSYSTEM
............................................................. 6-3
F
IGURE
6-3. NVIDIA TNT2 P
RO
G
RAPHICS
S
UBSYSTEM
........................................................................... 6-6
Compaq Deskpro and Evo Personal Computers
Featuring Intel Celeron and Pentium III Processors
Fifth Edition - March 2002
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